SIDC20D60C6 Infineon Technologies, SIDC20D60C6 Datasheet
SIDC20D60C6
Specifications of SIDC20D60C6
Related parts for SIDC20D60C6
SIDC20D60C6 Summary of contents
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... F 2 75A 5.37 x 3.75 mm 20.14 / 16.66 suitable for epoxy and soft solder die bonding electrically conductive glue or solder store in original container, in dry nitrogen, < 6 month at an ambient temperature of 23°C SIDC20D60C6 A C Package sawn on foil 5.37 x 3.75 4.67 x 3.05 70 150 180 ...
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... I =75A °C j di/dt=4000A ° =300V ° =75A °C j di/dt=4000A ° =300V ° SIDC20D60C6 Value Unit 600 150 -40...+175 C Value Unit min. Typ. max. 27 µA 600 V 1.2 1.6 1 Value Unit min. Typ. max. 100 115 A 125 3.00 6.00 µC 7.50 0.95 1. ...
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... CHIP DRAWING: Edited by INFINEON Technologies, AIM PMD D CID CLS, L4571M, Edition 1.1, 10.07.2006 SIDC20D60C6 ...
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... Life support devices or systems are intended to be implanted in the human body support and / or maintain and sustain and / or protect human life. If they fail reasonable to assume that the health of the user or other persons may be endangered. Edited by INFINEON Technologies, AIM PMD D CID CLS, L4571M, Edition 1.1, 10.07.2006 SIDC20D60C6 FS75R06KE3 ...