SIDC23D120E6 Infineon Technologies, SIDC23D120E6 Datasheet
SIDC23D120E6
Specifications of SIDC23D120E6
Related parts for SIDC23D120E6
SIDC23D120E6 Summary of contents
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... Die Size F 2 25A 3.5 x 6.5 mm suitable for epoxy and soft solder die bonding electrically conductive glue or solder store in original container, in dry nitrogen, < 6 month at an ambient temperature of 23°C SIDC23D120E6 A C Package Ordering Code Q67050-A4124- sawn on foil A001 3.5 x 6.5 22 ...
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... V =600V R I =25A ° di/dt=650A ° =25A di/dt=650A =25A / di/dt=650A =25A di/dt=650A SIDC23D120E6 Value Unit 1200 tbd 50 -55...+150 C Value Unit min. Typ. max. 27 µA 1200 V 1.9 V Value Unit min. Typ. max. tbd ns 23.9 A 30.4 2.46 µ C 5.43 tbd tbd 1 ...
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... Edited by INFINEON Technologies HV3, L 4272P, Edition 1, 8.01.2002 Preliminary SIDC23D120E6 ...
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... Life support devices or systems are intended to be implanted in the human body support and / or maintain and sustain and / or protect human life. If they fail reasonable to assume that the health of the user or other persons may be endangered. Edited by INFINEON Technologies HV3, L 4272P, Edition 1, 8.01.2002 Preliminary SIDC23D120E6 INFINEON TECHNOLOGIES / EUPEC tbd ...