... Die Size F 2 150A 7.8 x 4.9 mm suitable for epoxy and soft solder die bonding electrically conductive glue or solder store in original container, in dry nitrogen, < 6 month at an ambient temperature of 23°C SIDC38D60C6 Package sawn on foil 7.8 x 4.9 38.22 / 33.38 7.1 x 4.2 70 150 180 ...
... °C j di/dt=5400A ° =300V ° °C j di/dt=5400A ° =300V ° SIDC38D60C6 Value Unit 600 300 -40...+175 C Value Unit min. Typ. max. 27 µA 600 V 1.2 1.6 1 Value Unit min. Typ. max. 150 180 A 185 7.00 13.0 µC 15.0 1.95 3.50 mJ 3.95 ...
... Life support devices or systems are intended to be implanted in the human body support and / or maintain and sustain and / or protect human life. If they fail reasonable to assume that the health of the user or other persons may be endangered. Edited by INFINEON Technologies, AIM PMD D CID CLS, L4591M, Edition 1.1, 10.07.2006 SIDC38D60C6 FS150R06KE3 ...