SIDC56D120E6 Infineon Technologies, SIDC56D120E6 Datasheet
SIDC56D120E6
Specifications of SIDC56D120E6
Related parts for SIDC56D120E6
SIDC56D120E6 Summary of contents
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... Die Size F 2 75A 7.5 x 7.5 mm suitable for epoxy and soft solder die bonding electrically conductive glue or solder store in original container, in dry nitrogen, < 6 month at an ambient temperature of 23°C SIDC56D120E6 A C Package Ordering Code Q67050-A4127- sawn on foil A001 7.5 x 7.5 56 ...
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... V =600V R I =75A ° di/dt=1950A ° =75A di/dt=1950A =75A / di/dt=1950A =75A di/dt=1950A SIDC56D120E6 Value Unit 1200 tbd 150 -55...+150 C Value Unit min. Typ. max. 27 µA 1200 V 1.9 V Value Unit min. Typ. max. tbd ns 88.5 A 110 8.77 µ C 16.44 tbd tbd 1 ...
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... CHIP DRAWING: Edited by INFINEON Technologies HV3, L 4222P, Edition 1, 8.01.2002 Preliminary SIDC56D120E6 ...
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... Life support devices or systems are intended to be implanted in the human body support and / or maintain and sustain and / or protect human life. If they fail reasonable to assume that the health of the user or other persons may be endangered. Edited by INFINEON Technologies HV3, L 4222P, Edition 1, 8.01.2002 Preliminary SIDC56D120E6 INFINEON TECHNOLOGIES / EUPEC tbd ...