SIDC81D120E6 Infineon Technologies, SIDC81D120E6 Datasheet
SIDC81D120E6
Specifications of SIDC81D120E6
Related parts for SIDC81D120E6
SIDC81D120E6 Summary of contents
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... SMPS, resonant applications, drives I Die Size suitable for epoxy and soft solder die bonding electrically conductive glue or solder store in original container, in dry nitrogen, < 6 month at an ambient temperature of 23°C SIDC81D120E6 A C Package Ordering Code Q67050-A4128- sawn on foil A001 69.39 8.28 x 8.28 ...
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... C, unless otherwise specified, tested at component j Conditions ° di/dt=2600A ° =600V ° di/dt=2600A ° di/dt=2600A / di/dt=2600A di/dt=2600A SIDC81D120E6 Value Unit 1200 V 100 A tbd 200 -55...+150 C Value Unit min. Typ. max. 27 µA 1200 V 1.9 V Value Unit min. Typ. max. tbd ns 120 A 150 11.93 µ C 21.94 tbd tbd 1 ...
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... CHIP DRAWING: Edited by INFINEON Technologies HV3, L 4202P, Edition 1, 8.01.2002 Preliminary SIDC81D120E6 ...
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... Life support devices or systems are intended to be implanted in the human body support and / or maintain and sustain and / or protect human life. If they fail reasonable to assume that the health of the user or other persons may be endangered. Edited by INFINEON Technologies HV3, L 4202P, Edition 1, 8.01.2002 Preliminary SIDC81D120E6 INFINEON TECHNOLOGIES / EUPEC tbd ...