FDMA6023PZT Fairchild Semiconductor, FDMA6023PZT Datasheet - Page 3
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FDMA6023PZT
Manufacturer Part Number
FDMA6023PZT
Description
MOSFET P-CH DUAL 20V 6MICROFET
Manufacturer
Fairchild Semiconductor
Series
PowerTrench®r
Datasheet
1.FDMA6023PZT.pdf
(7 pages)
Specifications of FDMA6023PZT
Fet Type
2 P-Channel (Dual)
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
60 mOhm @ 3.6A, 4.5V
Drain To Source Voltage (vdss)
20V
Current - Continuous Drain (id) @ 25° C
3.6A
Vgs(th) (max) @ Id
1.5V @ 250µA
Gate Charge (qg) @ Vgs
17nC @ 4.5V
Input Capacitance (ciss) @ Vds
885pF @ 10V
Power - Max
700mW
Mounting Type
Surface Mount
Package / Case
6-UMLP, 6-MicroFET™
Configuration
Dual
Transistor Polarity
P-Channel
Resistance Drain-source Rds (on)
0.06 Ohm @ 4.5 V
Drain-source Breakdown Voltage
20 V
Gate-source Breakdown Voltage
+/- 8 V
Continuous Drain Current
3.6 A
Power Dissipation
1400 mW
Maximum Operating Temperature
+ 150 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 55 C
Module Configuration
Dual
Continuous Drain Current Id
-3.6A
Drain Source Voltage Vds
-20V
On Resistance Rds(on)
60mohm
Rds(on) Test Voltage Vgs
-4.5V
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
FDMA6023PZTTR
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
FDMA6023PZT
Manufacturer:
FAIRCHILD/仙童
Quantity:
20 000
©2009 Fairchild Semiconductor Corporation
FDMA6023PZT Rev.B1
Electrical Characteristics
Notes:
1. R
2. Pulse Test: Pulse Width < 300 µs, Duty cycle < 2.0%.
3. The diode connected between the gate and source serves only as protection against ESD. No gate overvoltage rating is implied.
user's board design.
θJA
(a) R
(b) R
(c) R
(d) R
is determined with the device mounted on a 1 in
θJA
θJA
θJA
θJA
= 86 °C/W when mounted on a 1 in
= 69 °C/Wwhen mounted on a 1 in
= 173 °C/W when mounted on a minimum pad of 2 oz copper. For single operation.
= 151 °C/W when mounted on a minimum pad of 2 oz copper. For dual operation.
a) 86
mounted on a
1in
copper.
2
pad of 2 oz
o
C/W when
2
2
pad of 2 oz copper, 1.5 " x 1.5 " x 0.062 " thick PCB. For dual operation.
pad of 2 oz copper, 1.5 " x 1.5 " x 0.062 " thick PCB. For single operation.
T
2
J
oz. copper pad on a 1.5 x 1.5 in. board of FR-4 material. R
= 25 °C unless otherwise noted
b)173
when mounted
on a minimum
pad of 2 oz
copper.
o
C/W
3
θJC
c) 69
mounted on a
1in
copper.
is guaranteed by design while R
2
pad of 2 oz
o
C/W when
θJA
is determined by the
www.fairchildsemi.com
d)151
when mounted
on a minimum
pad of 2 oz
copper.
o
C/W