FDY100PZ Fairchild Semiconductor, FDY100PZ Datasheet
FDY100PZ
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FDY100PZ Summary of contents
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... Thermal Resistance, Junction-to-Ambient R θJA Thermal Resistance, Junction-to-Ambient R θJA Package Marking and Ordering Information Device Marking Device A FDY100PZ ©2006 Fairchild Semiconductor Corporation FDY100PZ Rev A Features • – 350 mA, – – 2.5v. GS • ESD protection diode (note 3) • RoHS Compliant =25 C unless otherwise noted ...
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... Diode Reverse Recovery Charge rr Notes the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of θJA the drain pins guaranteed by design while R θJC a) FDY100PZ Rev 25°C unless otherwise noted A Test Conditions = – 250 µ ...
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... Figure 3. On-Resistance Variation with Temperature -5V DS 0.8 0.6 0 125 0 GATE TO SOURCE VOLTAGE (V) GS Figure 5. Transfer Characteristics. FDY100PZ Rev A 2.6 V =-1.8V GS 2.2 -2.0V 1.8 1.4 -1.8V 1 0.6 0 1.5 2 Figure 2. On-Resistance Variation with Drain Current and Gate Voltage. 2 1.75 1.5 1. ...
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... SINGLE PULSE 0.01 0.0001 0.001 Figure 11. Transient Thermal Response Curve. Thermal characterization performed using the conditions described in Note 1b. Transient thermal response will change depending on the circuit board design. FDY100PZ Rev A 150 125 100 rss 0 2 2.5 0 Figure 8 ...
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... NOTES: UNLESS OTHERWISE SPECIFIED A) THIS PACKAGE CONFORMS TO EIAJ SC89 PACKAGING STANDARD. B) ALL DIMENSIONS ARE IN MILLIMETERS. C) DIMENSIONS ARE EXCLUSIVE OF BURRS, MOLD FLASH, AND TIE BAR EXTRUSIONS. FDY100PZ Rev A 0.50 1.70 1.14 1.50 0.50 LAND PATTERN RECOMMENDATION 0.78 0.58 SEE DETAIL A ...
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... TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended exhaustive list of all such trademarks. FAST ® ACEx™ ActiveArray™ FASTr™ Bottomless™ FPS™ Build it Now™ FRFET™ CoolFET™ ...