DS12CR887-33 Maxim Integrated Products, DS12CR887-33 Datasheet - Page 8
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DS12CR887-33
Manufacturer Part Number
DS12CR887-33
Description
Real Time Clock
Manufacturer
Maxim Integrated Products
Datasheet
1.DS12885N.pdf
(22 pages)
Specifications of DS12CR887-33
Function
Clock, Calendar
Rtc Memory Size
114 B
Supply Voltage (max)
3.63 V
Supply Voltage (min)
2.97 V
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Mounting Style
Through Hole
Rtc Bus Interface
Multiplexed
Package / Case
eDIP
Time Format
HH:MM:SS, Binary
Date Format
DW:DM:M:Y, Binary
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DS12CR887-33+
Manufacturer:
MAXIM/美信
Quantity:
20 000
Real-Time Clocks
8
12, 16
PDIP
4–11
SO,
13
14
15
1
2
3
_____________________________________________________________________
EDIP
4–11
12
13
14
15
—
—
1
PIN
PLCC
12, 14
15, 20
5–10,
16
17
19
2
3
4
1, 2, 3,
5, 7, 8,
12, 17
TQFP
9, 11
29
30
31
13
14
16
NAME
AD0–
MOT
GND
AD7
R/W
CS
AS
X1
X2
Motorola or Intel Bus Timing Selector. This pin selects one of two bus types. When
connected to V
left disconnected, Intel bus timing is selected. The pin has an internal pulldown
resistor.
Connections for Standard 32.768kHz Quartz Crystal. The internal oscillator
circuitry is designed for operation with a crystal having a 6pF specified load
capacitance (C
connected to an external 32.768kHz oscillator. The output of the internal oscillator,
pin X2, is left unconnected if an external oscillator is connected to pin X1.
Multiplexed, Bidirectional Address/Data Bus. The addresses are presented during
the first portion of the bus cycle and latched into the device by the falling edge of
AS. Write data is latched by the falling edge of DS (Motorola timing) or the rising
edge of R/W (Intel timing). In a read cycle, the device outputs data during the
latter portion of DS (DS and R/W high for Motorola timing, DS low and R/W high for
Intel timing). The read cycle is terminated and the bus returns to a high-
impedance state as DS transitions low in the case of Motorola timing or as DS
transitions high in the case of Intel timing.
Ground
Active-Low Chip-Select Input. The chip-select signal must be asserted low for a
bus cycle in the device to be accessed. CS must be kept in the active state during
DS and AS for Motorola timing and during DS and R/W for Intel timing. Bus cycles
that take place without asserting CS will latch addresses, but no access occurs.
When V
CS input. This action protects the RTC data and the RAM data during power
outages.
Address Strobe Input. A positive-going address-strobe pulse serves to
demultiplex the bus. The falling edge of AS causes the address to be latched
within the device. The next rising edge that occurs on the AS bus clears the
address regardless of whether CS is asserted. An address strobe must
immediately precede each write or read access. If a write or read is performed
with CS deasserted, another address strobe must be performed prior to a read or
write access with CS asserted.
Read/Write Input. The R/W pin has two modes of operation. When the MOT pin is
connected to V
current cycle is a read or write. A read cycle is indicated with a high level on R/W
while DS is high. A write cycle is indicated when R/W is low during DS. When the
MOT pin is connected to GND for Intel timing, the R/W signal is an active-low
signal. In this mode, the R/W pin operates in a similar fashion as the write-enable
signal (WE) on generic RAMs. Data are latched on the rising edge of the signal.
CC
is below V
CC
CC
L
). Pin X1 is the input to the oscillator and can optionally be
, Motorola bus timing is selected. When connected to GND or
for Motorola timing, R/W is at a level that indicates whether the
PF
volts, the device inhibits access by internally disabling the
FUNCTION
Pin Description