FIN1022MTC_Q Fairchild Semiconductor, FIN1022MTC_Q Datasheet

Analog & Digital Crosspoint ICs HS Crosspoint Switch 3x2 LVDS

FIN1022MTC_Q

Manufacturer Part Number
FIN1022MTC_Q
Description
Analog & Digital Crosspoint ICs HS Crosspoint Switch 3x2 LVDS
Manufacturer
Fairchild Semiconductor
Datasheet

Specifications of FIN1022MTC_Q

Mounting Style
SMD/SMT
Number Of Arrays
1
Operating Supply Voltage
3.3 V
Supply Type
Single
Configuration
2 x 2
Package / Case
TSSOP-16
Data Rate
0.8 Gbps
Input Level
LVTTL
Supply Voltage (max)
3.6 V
Supply Voltage (min)
3 V
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Product
Digital Crosspoint
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
© 2001 Fairchild Semiconductor Corporation
FIN1022M
FIN1022MTC
FIN1022
2 X 2 LVDS High Speed Crosspoint Switch
General Description
This non-blocking 2x2 crosspoint switch has a fully differ-
ential input to output data path for low noise generation and
low pulse width distortion. The device can be used as a
high speed crosspoint switch, 2:1 multiplexer, 1:2 demulti-
plexer or 1:2 signal splitter. The inputs can directly interface
with LVDS and LVPECL levels.
Ordering Code:
Devices also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering code.
Logic Symbol
Order Number
Package Number
MTC16
M16A
16-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow
16-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
DS500653
Features
Low jitter, 800 Mbps full differential data path
Worst case jitter of 190ps
with PRBS
Rail-to-rail common mode range is 0.5V to 3.25V
Worst case power dissipation is less than 126 mW
Open-circuit fail safe protection
Fast switch time of 1.1 ns typical
35 ps typical pin channel to channel skew
3.3V power supply operation
Non-blocking switch
LVDS receiver inputs accept LVPECL signals directly
7.5 kV HBM ESD protection
16-lead SOIC package and TSSOP package
Inter-operates with TIA/EIA 644-1995 specification
See the Fairchild Interface Solutions web page for cross
reference information:
www.fairchildsemi.com/products/interface/lvds.html
Package Description
2
23
1 data pattern at 800 Mbps
September 2001
Revised December 2001
www.fairchildsemi.com

Related parts for FIN1022MTC_Q

FIN1022MTC_Q Summary of contents

Page 1

... Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide Devices also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering code. Logic Symbol © 2001 Fairchild Semiconductor Corporation Features Low jitter, 800 Mbps full differential data path ...

Page 2

Connection Diagram Function Table Inputs SEL SEL ...

Page 3

Absolute Maximum Ratings Supply Voltage ( Input Voltage ( Output Voltage (V ) OUT Driver Short Circuit Current (I ) OSD Storage Temperature Range (T ) STG Max Junction Temperature ( Lead ...

Page 4

AC Electrical Characteristics Over supply voltage and operating temperature ranges, unless otherwise specified Symbol Parameter t Differential Output Propagation Delay PLHD LOW-to-HIGH t Differential Output Propagation Delay PHLD HIGH-to-LOW t Differential Output Rise Time (20% to 80%) TLHD t Differential ...

Page 5

Required Specifications 1. When the true and complement LVDS outputs (having a 75 connected between outputs) are connected to 3.75 k resistors and the common point of those 3.75 k resistors are connected to a voltage source that sweeps from ...

Page 6

Required Specifications (Continued) FIGURE 3. LVDS Driver DC Test Circuit FIGURE 5. LVDS Input to LVDS Output AC Waveforms www.fairchildsemi.com Note A: All input pulses have frequency 50 MHz Note B: C includes all probe and jig capacitances ...

Page 7

Required Specifications (Continued) FIGURE 7. LVTTL Input to LVDS Output AC Waveforms FIGURE 9. Enable and Disable AC Waveforms Note A: All input pulses have frequency 10MHz Note B: C includes all probe and jig capacitances. ...

Page 8

Required Specifications (Continued) FIGURE 10. Set-up and Hold Time Specification www.fairchildsemi.com 8 ...

Page 9

Physical Dimensions inches (millimeters) unless otherwise noted 16-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow Package Number M16A 9 www.fairchildsemi.com ...

Page 10

Physical Dimensions inches (millimeters) unless otherwise noted (Continued) 16-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves ...

Related keywords