2N7002E,215 NXP Semiconductors, 2N7002E,215 Datasheet
2N7002E,215
Specifications of 2N7002E,215
2N7002E T/R
2N7002E,215
568-4858-2
934056996215
Related parts for 2N7002E,215
2N7002E,215 Summary of contents
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N-channel TrenchMOS FET Rev. 03 — 28 April 2006 1. Product profile 1.1 General description N-channel enhancement mode Field-Effect Transistor (FET plastic package using TrenchMOS technology. 1.2 Features Logic level threshold compatible Surface-mounted package 1.3 Applications Logic ...
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Philips Semiconductors 3. Ordering information Table 2: Ordering information Type number Package Name 2N7002E TO-236AB 4. Limiting values Table 3: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter V drain-source voltage DS V drain-gate ...
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Philips Semiconductors 120 P der (%) 100 P tot P = ------------------------ 100 % der P tot 25 C Fig 1. Normalized total power dissipation as a function of solder point temperature ...
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Philips Semiconductors 5. Thermal characteristics Table 4: Thermal characteristics Symbol Parameter R thermal resistance from junction to solder point th(j-sp) R thermal resistance from junction to ambient th(j-a) Mounted on a printed-circuit board; minimum footprint; vertical in still air [1] ...
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Philips Semiconductors 6. Characteristics Table 5: Characteristics unless otherwise specified. j Symbol Parameter Static characteristics V drain-source breakdown (BR)DSS voltage V gate-source threshold voltage GS(th) I drain leakage current DSS I gate leakage current GSS R ...
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Philips Semiconductors (A) 0.8 0.6 0 Fig 5. Output characteristics: drain current as a function of drain-source voltage; typical values (A) 0.8 0.6 ...
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Philips Semiconductors 3 V max GS(th) (V) typ 2 min 0.25 mA Fig 9. Gate-source threshold voltage as a function of junction temperature 0.3 ...
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Philips Semiconductors (A) 0.8 0.6 0.4 0.2 150 C 0 0.2 0.4 0 and 150 Fig 13. Source current as a function of source-drain voltage; typical values 2N7002E_3 Product ...
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Philips Semiconductors 7. Package outline Plastic surface-mounted package; 3 leads DIMENSIONS (mm are the original dimensions UNIT max. 1.1 0.48 0.15 mm 0.1 0.9 0.38 0.09 OUTLINE VERSION IEC SOT23 Fig 15. ...
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Philips Semiconductors 8. Revision history Table 6: Revision history Document ID Release date 2N7002E_3 20060428 • Modifications: Table 5 • Table 5 • Table 5 • Table 5 • Table 5 • Table 5 • Table 5 • Figure • ...
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Philips Semiconductors 9. Data sheet status [1] Level Data sheet status Product status I Objective data Development II Preliminary data Qualification III Product data Production [1] Please consult the most recently issued data sheet before initiating or completing a design. ...
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Philips Semiconductors 14. Contents 1 Product profi 1.1 General description ...