TDA8931T NXP Semiconductors, TDA8931T Datasheet - Page 19

Comparator ICs 1 CHAN CLASS D AMP 1X15W

TDA8931T

Manufacturer Part Number
TDA8931T
Description
Comparator ICs 1 CHAN CLASS D AMP 1X15W
Manufacturer
NXP Semiconductors
Datasheet

Specifications of TDA8931T

Number Of Channels
1 Channel
Product
Digital Comparators
Response Time
0.12 us
Offset Voltage (max)
10 mV
Input Bias Current (max)
0.06 uA
Supply Voltage (max)
35 V
Supply Voltage (min)
12 V
Maximum Power Dissipation
2500 mW
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Package / Case
SOT-163
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
TDA8931T/N1,112

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
TDA8931T
Manufacturer:
PHILIPS/飞利浦
Quantity:
20 000
Part Number:
TDA8931TN1
Quantity:
2 000
Philips Semiconductors
9397 750 13847
Preliminary data sheet
Fig 7. Thermal vias (top view)
14.4.1 Thermal layout including vias
14.4.2 Thermal considerations
11
20
The bottom side of the double-sided PCB is used to place the SMD components including
the TDA8931T and the majority of the signal tracks. The topside is used to place the
leaded components.
The remaining area on both top and bottom layer are filled with ground plane for a proper
cooling. In this way it is possible to have a cooling area available of about:
The PCB area required for a typical mono amplifier is 21.5 cm
of about 28 cm
flow to the top layer of the PCB.
dots and
To estimate the maximum junction temperature, the following equation can be used:
Where:
T
j max
T
P
R
amb
d
th(j-a)
40 % of the PCB area on the bottom (60 % for signal tracks and SMD components)
90 % of the PCB area on the top (10 % for signal tracks)
= power dissipation in the TDA8931T
= ambient temperature
=
= thermal resistance from junction to ambient (24 K/W)
Figure 8
T
amb
2
+
. Thermal vias should be placed close to corner leads for a proper heat
R
is showing the heat flow to the copper area on the top layer.
th j a
10
1
001aac238
Rev. 01 — 14 January 2004
P
d
Figure 7
Fig 8. Heat flow (cross section view)
bottom layer
top layer
is showing the thermal vias indicated as black
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Power comparator 1
2
resulting in a cooling area
TDA8931
TDA8931T
001aac239
19 of 31
20 W
(5)

Related parts for TDA8931T