IPD30N03S4L-14 Infineon Technologies, IPD30N03S4L-14 Datasheet

MOSFET N-CH 30V 30A TO252-3

IPD30N03S4L-14

Manufacturer Part Number
IPD30N03S4L-14
Description
MOSFET N-CH 30V 30A TO252-3
Manufacturer
Infineon Technologies
Series
OptiMOS™r
Datasheet

Specifications of IPD30N03S4L-14

Package / Case
DPak, TO-252 (2 leads+tab), SC-63
Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
13.6 mOhm @ 30A, 10V
Drain To Source Voltage (vdss)
30V
Current - Continuous Drain (id) @ 25° C
30A
Vgs(th) (max) @ Id
2.2V @ 10µA
Gate Charge (qg) @ Vgs
14nC @ 10V
Input Capacitance (ciss) @ Vds
980pF @ 25V
Power - Max
31W
Mounting Type
Surface Mount
Minimum Operating Temperature
- 55 C
Configuration
Single
Transistor Polarity
N-Channel
Resistance Drain-source Rds (on)
13.6 m Ohms
Drain-source Breakdown Voltage
30 V
Gate-source Breakdown Voltage
1 V
Continuous Drain Current
30 A
Power Dissipation
31 W
Maximum Operating Temperature
+ 175 C
Mounting Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
IPD30N03S4L-14
IPD30N03S4L-14TR
SP000275919

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
IPD30N03S4L-14
Manufacturer:
INFINEON
Quantity:
12 500
Part Number:
IPD30N03S4L-14
0
Rev. 2.1
OptiMOS
Features
• N-channel - Enhancement mode
• Automotive AEC Q101 qualified
• MSL1 up to 260°C peak reflow
• 175°C operating temperature
• Green product (RoHS compliant)
• Ultra low Rds(on)
• 100% Avalanche tested
Maximum ratings, at T
Parameter
Continuous drain current
Pulsed drain current
Avalanche energy, single pulse
Avalanche current, single pulse
Gate source voltage
Power dissipation
Operating and storage temperature
IEC climatic category; DIN IEC 68-1
Type
IPD30N03S4L-14
®
-T2 Power-Transistor
2)
Package
PG-TO252-3-11
j
=25 °C, unless otherwise specified
1)
Symbol
I
I
E
I
V
P
T
D
D,pulse
AS
j
AS
GS
tot
, T
Marking
4N03L14
stg
T
T
V
T
I
T
T
D
C
C
C
C
C
GS
=30 A
page 1
=25 °C, V
=100 °C,
=25 °C
=25 °C
=25 °C
=10 V
Conditions
2)
GS
Product Summary
V
R
I
D
=10 V
DS
DS(on),max
-55 ... +175
55/175/56
Value
120
±16
30
27
16
30
31
PG-TO252-3-11
IPD30N03S4L-14
13.6
30
30
2008-04-18
Unit
A
mJ
A
V
W
°C
V
m
A

Related parts for IPD30N03S4L-14

IPD30N03S4L-14 Summary of contents

Page 1

... Operating and storage temperature IEC climatic category; DIN IEC 68-1 Rev. 2.1 Product Summary DS(on),max I D Marking 4N03L14 Symbol Conditions I T =25 ° =100 ° = =25 °C D,pulse = =25 ° =25 °C tot stg page 1 IPD30N03S4L- 13 PG-TO252-3-11 Value Unit 120 ± -55 ... +175 °C 55/175/56 2008-04-18 ...

Page 2

... Conditions R thJC R minimal footprint thJA cooling area =25 °C, unless otherwise specified (BR)DSS =10 µA GS(th = DSS T =25 ° = =125 ° = =85 ° = GSS =4 =15 A DS( page 2 IPD30N03S4L-14 Values min. typ. max 4 1.0 1 1000 = 100 - 16.1 20.5 - 11.2 13.6 Unit K µ 2008-04-18 ...

Page 3

... plateau =25 ° S,pulse = =25 ° = /dt =100 A/µ 4.9K/W the chip is able to carry 38A at 25°C. For detailed information thJC 2 (one layer, 70 µm thick) copper area for drain page 3 IPD30N03S4L-14 Values min. typ. max. - 750 = 190 - = 2 0.6 0. Unit 980 pF 250 20 - ...

Page 4

... parameter 1000 100 Rev. 2.1 2 Drain current 150 200 0 4 Max. transient thermal impedance Z = f(t thJC parameter µs 10 µ 100 µ 100 [V] page 4 IPD30N03S4L- ≥ 100 150 T [° 0.5 0.1 0.05 0.01 single pulse - [s] p 200 - 2008-04-18 ...

Page 5

... DS 7 Typ. transfer characteristics parameter 120 100 Rev. 2.1 6 Typ. drain-source on-state resistance R = f(I DS(on) parameter [V] 8 Typ. drain-source on-state resistance R = f(T DS(on) 20 -55 °C 25 °C 175 ° -60 [V] page 5 IPD30N03S4L- ° 100 T [° 100 140 180 2008-04-18 ...

Page 6

... V SD Rev. 2.1 10 Typ. capacitances 100 µ 100 140 180 12 Typ. avalanche characteristics parameter: T 100 °C 0.1 0.8 1 1.2 1.4 [V] page 6 IPD30N03S4L- MHz [ j(start) 100 °C 150 ° 100 t [µs] AV Ciss Coss Crss °C 1000 2008-04-18 ...

Page 7

... Typical avalanche energy parameter 7 [° Typ. gate charge pulsed GS gate D parameter gate Rev. 2.1 14 Typ. drain-source breakdown voltage V BR(DSS 125 175 16 Gate charge waveforms s(th (th [nC] page 7 IPD30N03S4L- -55 - 105 T [° 145 Q gate 2008-04-18 ...

Page 8

... Life support devices or systems are intended to be implanted in the human body support and/or maintain and sustain and/or protect human life. If they fail reasonable to assume that the health of the user or other persons may be endangered. Rev. 2.1 page 8 IPD30N03S4L-14 2008-04-18 ...

Page 9

... Revision History Version Revision 2.1 Rev. 2.1 Date 18.04.2008 page 9 IPD30N03S4L-14 Changes Update of type and marking in table on page one 2008-04-18 ...

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