IRFR214TRR Vishay, IRFR214TRR Datasheet

MOSFET N-CH 250V 2.2A DPAK

IRFR214TRR

Manufacturer Part Number
IRFR214TRR
Description
MOSFET N-CH 250V 2.2A DPAK
Manufacturer
Vishay
Datasheet

Specifications of IRFR214TRR

Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Standard
Rds On (max) @ Id, Vgs
2 Ohm @ 1.3A, 10V
Drain To Source Voltage (vdss)
250V
Current - Continuous Drain (id) @ 25° C
2.2A
Vgs(th) (max) @ Id
4V @ 250µA
Gate Charge (qg) @ Vgs
8.2nC @ 10V
Input Capacitance (ciss) @ Vds
140pF @ 25V
Power - Max
2.5W
Mounting Type
Surface Mount
Package / Case
DPak, TO-252 (2 leads+tab), SC-63
Configuration
Single
Transistor Polarity
N-Channel
Resistance Drain-source Rds (on)
2 Ohms
Drain-source Breakdown Voltage
250 V
Gate-source Breakdown Voltage
+/- 20 V
Continuous Drain Current
2.2 A
Power Dissipation
2.5 W
Maximum Operating Temperature
+ 150 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 55 C
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Note
a. See device orientation.
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. V
c. I
d. 1.6 mm from case.
e. When mounted on 1” square PCB (FR-4 or G-10 Material).
* Pb containing terminations are not RoHS compliant, exemptions may apply
Document Number: 91269
S-82987-Rev. B, 19-Jan-09
PRODUCT SUMMARY
V
R
Q
Q
Q
Configuration
ORDERING INFORMATION
Package
Lead (Pb)-free
SnPb
ABSOLUTE MAXIMUM RATINGS T
PARAMETER
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current
Pulsed Drain Current
Linear Derating Factor
Linear Derating Factor (PCB Mount)
Single Pulse Avalanche Energy
Repetitive Avalanche Current
Repetitive Avalanche Energy
Maximum Power Dissipation
Maximum Power Dissipation (PCB Mount)
Peak Diode Recovery dV/dt
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)
DS
DS(on)
g
gs
gd
SD
DD
(TO-252)
D
(Max.) (nC)
(nC)
(nC)
DPAK
(V)
≤ 2.2 A, dI/dt ≤ 65 A/µs, V
= 50 V, Starting T
(Ω)
G
S
D
(TO-251)
IPAK
a
J
DPAK (TO-252)
IRFR214PbF
SiHFR214-E3
IRFR214
SiHFR214
= 25 °C, L = 62 mH, R
G
c
a
a
D S
DD
b
V
≤ V
GS
e
= 10 V
DS
G
, T
N-Channel MOSFET
J
e
Single
≤ 150 °C.
250
8.2
1.8
4.5
G
DPAK (TO-252)
IRFR214TRLPbF
SiHFR214TL-E3
-
-
= 25 Ω, I
D
S
C
Power MOSFET
= 25 °C, unless otherwise noted
V
IRFR214, IRFU214, SiHFR214, SiHFU214
2.0
GS
AS
at 10 V
= 2.2 A (see fig. 12).
T
T
for 10 s
C
A
a
a
= 25 °C
= 25 °C
T
T
C
C
DPAK (TO-252)
IRFR214TRPbF
SiHFR214T-E3
IRFR214TR
SiHFR214T
= 100 °C
= 25 °C
FEATURES
• Dynamic dV/dt Rating
• Repetitive Avalanche Rated
• Surface Mount (IRFR9210/SiHFR9210)
• Straight Lead (IRFU9210/SiHFU9210)
• Available in Tape and Reel
• Fast Switching
• Ease of Paralleling
• Lead (Pb)-free Available
DESCRIPTION
Third generation Power MOSFETs from Vishay provide the
designer with the best combination of fast switching,
ruggedized
cost-effectiveness.
The D-PAK is designed for surface mounting using vapor
phase, infrared, or wave soldering techniques. The straight
lead version (IRFU/SiHFU series) is for through-hole
mounting applications. Power dissipation levels up to 1.5 W
are possible in typical surface mount applications.
a
a
SYMBOL
T
a
a
dV/dt
J
V
V
E
E
I
I
P
P
, T
device
I
DM
AR
DS
GS
AS
AR
D
D
D
stg
DPAK (TO-252)
-
-
IRFR214TRR
SiHFR214TR
design,
- 55 to + 150
a
a
LIMIT
0.020
260
± 20
0.20
250
190
2.2
1.4
8.8
2.2
2.5
2.5
4.8
25
low
d
Vishay Siliconix
on-resistance
IPAK (TO-251)
IRFU214PbF
SiHFU214-E3
IRFU214
SiHFU214
www.vishay.com
UNIT
W/°C
V/ns
RoHS*
COMPLIANT
mJ
mJ
°C
W
W
V
A
A
Available
and
1

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IRFR214TRR Summary of contents

Page 1

... ° °C A for Ω 2.2 A (see fig. 12 ≤ 150 °C. J Vishay Siliconix device design, low on-resistance DPAK (TO-252) IPAK (TO-251 IRFU214PbF a - SiHFU214- IRFR214TRR IRFU214 a a SiHFR214TR SiHFU214 SYMBOL LIMIT V 250 DS V ± 2 1.4 I 8.8 DM 0.20 0.020 E 190 2.5 ...

Page 2

... IRFR214, IRFU214, SiHFR214, SiHFU214 Vishay Siliconix THERMAL RESISTANCE RATINGS PARAMETER Maximum Junction-to-Ambient Maximum Junction-to-Ambient a (PCB Mount) Maximum Junction-to-Case (Drain) Note a. When mounted on 1" square PCB (FR-4 or G-10 material). SPECIFICATIONS °C, unless otherwise noted J PARAMETER Static Drain-Source Breakdown Voltage V Temperature Coefficient DS Gate-Source Threshold Voltage ...

Page 3

... TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted Fig Typical Output Characteristics, T Fig Typical Output Characteristics, T Document Number: 91269 S-82987-Rev. B, 19-Jan-09 IRFR214, IRFU214, SiHFR214, SiHFU214 = 25 °C Fig Typical Transfer Characteristics C = 150 °C Fig Normalized On-Resistance vs. Temperature C Vishay Siliconix www.vishay.com 3 ...

Page 4

... IRFR214, IRFU214, SiHFR214, SiHFU214 Vishay Siliconix Fig Typical Capacitance vs. Drain-to-Source Voltage Fig Typical Gate Charge vs. Gate-to-Source Voltage www.vishay.com 4 Fig Typical Source-Drain Diode Forward Voltage Fig Maximum Safe Operating Area Document Number: 91269 S-82987-Rev. B, 19-Jan-09 ...

Page 5

... Fig Maximum Effective Transient Thermal Impedance, Junction-to-Case Document Number: 91269 S-82987-Rev. B, 19-Jan-09 IRFR214, IRFU214, SiHFR214, SiHFU214 Pulse width ≤ 1 µs Duty factor ≤ 0.1 % Fig. 10a - Switching Time Test Circuit d(on) Fig. 10b - Switching Time Waveforms Vishay Siliconix D.U. d(off) f www.vishay.com 5 ...

Page 6

... IRFR214, IRFU214, SiHFR214, SiHFU214 Vishay Siliconix V DS Vary t to obtain p required I AS D.U. Fig. 12a - Unclamped Inductive Test Circuit Charge Fig. 13a - Basic Gate Charge Waveform www.vishay.com 0.01 Ω Fig. 12b - Unclamped Inductive Waveforms Fig. 12c - Maximum Avalanche Energy vs. Drain Current ...

Page 7

... V GS Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability data, see www.vishay.com/ppg?91269. Document Number: 91269 S-82987-Rev ...

Page 8

... Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay’ ...

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