BSS138LT1G ON Semiconductor, BSS138LT1G Datasheet

MOSFET N-CH 50V 200MA SOT-23

BSS138LT1G

Manufacturer Part Number
BSS138LT1G
Description
MOSFET N-CH 50V 200MA SOT-23
Manufacturer
ON Semiconductor
Type
Power MOSFETr
Datasheets

Specifications of BSS138LT1G

Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
3.5 Ohm @ 200mA, 5V
Drain To Source Voltage (vdss)
50V
Current - Continuous Drain (id) @ 25° C
200mA
Vgs(th) (max) @ Id
1.5V @ 1mA
Input Capacitance (ciss) @ Vds
50pF @ 25V
Power - Max
225mW
Mounting Type
Surface Mount
Package / Case
SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
Configuration
Single
Transistor Polarity
N-Channel
Resistance Drain-source Rds (on)
3.5 Ohm @ 5 V
Forward Transconductance Gfs (max / Min)
0.1 S
Drain-source Breakdown Voltage
50 V
Gate-source Breakdown Voltage
+/- 20 V
Continuous Drain Current
0.2 A
Power Dissipation
225 mW
Maximum Operating Temperature
+ 150 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 55 C
Current, Drain
200 mA
Package Type
SOT-23 (TO-236)
Polarization
N-Channel
Resistance, Drain To Source On
3.5 Ohms
Temperature, Operating, Maximum
+150 °C
Temperature, Operating, Minimum
-55 °C
Time, Turn-off Delay
20 ns
Time, Turn-on Delay
20 ns
Transconductance, Forward
100 Millimhos
Voltage, Breakdown, Drain To Source
50 V
Voltage, Gate To Source
±20 VDC
Number Of Elements
1
Polarity
N
Channel Mode
Enhancement
Drain-source On-res
3.5Ohm
Drain-source On-volt
50V
Gate-source Voltage (max)
±20V
Drain Current (max)
200mA
Output Power (max)
Not RequiredW
Frequency (max)
Not RequiredMHz
Noise Figure
Not RequireddB
Power Gain
Not RequireddB
Drain Efficiency
Not Required%
Operating Temp Range
-55C to 150C
Operating Temperature Classification
Military
Mounting
Surface Mount
Pin Count
3
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Gate Charge (qg) @ Vgs
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
BSS138LT1GOSTR

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0
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION
26 May 2009
SUBJECT: ON Semiconductor Final Product/Process Change Notification #16257
TITLE: Copper Wire replacing Gold Wire in the SOT23 Package for MOSFET Products
PROPOSED FIRST SHIP DATE: 25 Aug 2009
AFFECTED CHANGE CATEGORY(S): ON Semiconductor SOT23 Assembly Areas – Wire
Bond
AFFECTED PRODUCT DIVISION(S): PowerFET Business Unit
FOR ANY QUESTIONS CONCERNING THIS NOTIFICATION:
Contact your local ON Semiconductor Sales Office or Kevin Ream <Kevin.Ream@onsemi.com>
SAMPLES: Contact your local ON Semiconductor Sales Office or Jennie Shen
<Jennie.Shen@onsemi.com>
ADDITIONAL RELIABILITY DATA: Available
Contact your local ON Semiconductor Sales Office or Donna Scheuch <d.scheuch@onsemi.com>
NOTIFICATION TYPE:
Final Product/Process Change Notification (FPCN)
Final change notification sent to customers. FPCNs are issued at least 90 days prior to implementation
of the change.
ON Semiconductor will consider this change approved unless specific conditions of acceptance are
provided in writing within 30 days of receipt of this notice. To do so, contact your local ON
Semiconductor Sales Office.
DESCRIPTION AND PURPOSE:
ON Semiconductor is notifying customers of its use of Copper Wire (in place of Gold Wire) for
their SOT23 Packaged Products assembled with MOSFET Die. SOT23 Products built with
Planar and Trench MOSFET platforms are represented by this Process Change Notice.
Reliability Qualification and full electrical characterization over temperature has been
performed.
Issue Date: 26 May 2009
Rev.14 Jun 2007
Page 1 of 5

BSS138LT1G Summary of contents

Page 1

... To do so, contact your local ON Semiconductor Sales Office. DESCRIPTION AND PURPOSE: ON Semiconductor is notifying customers of its use of Copper Wire (in place of Gold Wire) for their SOT23 Packaged Products assembled with MOSFET Die. SOT23 Products built with Planar and Trench MOSFET platforms are represented by this Process Change Notice. ...

Page 2

Final Product/Process Change Notification #16257 RELIABILITY DATA SUMMARY: Package: SOT-23 Qual Vehicles: NTR4502PT1G 2N7002LT1G NTR0202PLT1G NTR2101PT1G NTR4502PT1G Test: Conditions: HTRB Ta=150C, Vds=80% Rated BVdss HTGB Ta=150C, Vgs= 100% rated BVgss Precondition MSL1@ 260C , 260 C/260 ...

Page 3

... There is no change in electrical parametric performance. Characterization data is available upon request. CHANGED PART IDENTIFICATION: SOT23 Products assembled with the Copper Wire from the ON Semiconductor facility in Leshan, China, will have a Finish Good Date Code representing Work Week 31, 2009 or newer. Issue Date: 26 May 2009 Rev ...

Page 4

... BSS123LT1G BSS123LT1 BSS123LT3G BSS123LT3 BSS138LT1G BSS138LT1H B33138LT1 BSS138LT3G BSS138LT3H BSS138LT3 SBSS138LT1G SBSS138LT1G NTR0202PLT1G NTR0202PLT1G NTR0202PLT3G NTR0202PLT3 NTR1P02LT1G NTR1P02LT1H NTR1P02LT1 NTR1P02LT3G NTR1P02T1G NTR1P02T1 NTR1P02T3G NTR1P02T3 NTR2101PT1G NTR2101PT1H NTR2101PT1 NTR3161NT1G NTR3161NT3G NTR3162PT1G NTR3162PT3G NTR4101PT1G ...

Page 5

Final Product/Process Change Notification #16257 NTR4501NT3 NTR4502PT1G NTR4502PT1 NTR4502PT3G NTR4503NT1G NTR4503NT1H NTR4503NT1 NTR4503NT3G MMBF0201NLT1G MMBF0201NLT1 MMBF0202PLT1G MMBF0202PLT1 MMBF170LT1G MMBF170LT1 MMBF170LT3G MMBF170LT3 MMBF2201NT1G MMBF2201NT1 MMBF2202PT1G MMBF2202PT1 MMBFV170LT1G MMBFV170LT3G Issue Date: 26 May 2009 Rev.14 Jun 2007 Page ...

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