CE LMK316 B7475KL-T Taiyo Yuden, CE LMK316 B7475KL-T Datasheet - Page 57
![no-image](/images/manufacturer_photos/0/6/649/taiyo_yuden_sml.jpg)
CE LMK316 B7475KL-T
Manufacturer Part Number
CE LMK316 B7475KL-T
Description
Cap Ceramic 4.7uF 10VDC X7R 10% SMD 1206 T/R
Manufacturer
Taiyo Yuden
Type
Flatr
Datasheet
1.CE_AMK107_BJ106MA-T.pdf
(61 pages)
Specifications of CE LMK316 B7475KL-T
Package/case
1206
Mounting
Surface Mount
Capacitance Value
4.7 uF
Dielectric
X7R
Voltage
10 Vdc
Product Length
3.2 mm
Product Height
1.6 mm
Tolerance
10 %
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110
多层陶瓷电容器
2.印刷线路板设计
使用注意事项
工 序 名
(分割印刷线路板上电容器配置)
◆安装定位设计
1.安装电容器至印刷线路板后,在连续生产工序中(印刷线路板
分割、线路板检测、其他部件安装、底盘组装、波峰焊与回
流焊等等)或在操作过程中会产生印刷线路板弯曲、晶片破裂
等情况,因此请将电容器配置在印刷线路板弯曲时所受应力
最小处。
注 意 事 项
1-1.要对印刷线路板的弯曲处不施加过度的机械应力,推荐如下所示配置电容器。
1-2.将电容器安装在切割线路板上时,机械应力的大小由电容器的布局而定。请参考下图:
LWDC用推荐焊垫尺寸 (单位mm)
和 引 线 元 件 混
合安装
靠 近 底 盘 的 元
件安装
引 线 元 件 后 安
装
水平安装元件
(2) 防止及推荐事例
尺
寸
线路板弯曲
1-3.分割印刷线路板时,电容器所受机械应力的大小为 : 推板<割裂<V形凹槽<接缝
型号
A
B
C
项目
孔。因此,在配置电容器时必须同时考虑到印刷线路板的分割方法。
W
L
接缝孔
0.18∼0.22 0.25∼0.3 0.5∼0.7
0.2∼0.25 0.3∼0.4
0.9∼1.1
0.52
105
8
1.0
1.5∼1.7
焊枪
51.6
107
0.8
防止事例
割裂
应力大小
元件引线
防止事例
底盘
电极焊面
焊料(接地用)
0.4∼0.5
1.9∼2.1
管 理 要 点
后安装元件引线
1.25
212
2.0
(单位mm)
3.0∼3.4
0.8~1.0
0.4~0.5
316
3.2
1.6
推 荐 事 例
阻焊剂
推荐事例
阻焊剂
阻焊剂
阻焊剂
将元件对着
机械应力的方向横
2/6
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