QSH-030-01-F-D-A-TR Samtec Inc, QSH-030-01-F-D-A-TR Datasheet

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QSH-030-01-F-D-A-TR

Manufacturer Part Number
QSH-030-01-F-D-A-TR
Description
Conn Micro High Speed Socket Strip SKT 60 POS 0.5mm Solder ST SMD T/R
Manufacturer
Samtec Inc
Type
Micro High Speed Socket Stripr
Datasheet

Specifications of QSH-030-01-F-D-A-TR

Pitch
0.5 mm
Number Of Rows
2
Number Of Contacts
60
Gender
SKT
Contact Plating
Gold Over Nickel
Termination Method
Solder
Lead Free Status / RoHS Status

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Company
Part Number
Manufacturer
Quantity
Price
Part Number:
QSH-030-01-F-D-A-TR
Manufacturer:
Samtec Inc.
Quantity:
525
For complete specifi cations and
recommended PCB layouts see
www.samtec.com?QSH
Insulator Material:
Liquid Crystal
Polymer
Contact Material:
Phosphor Bronze
Plating:
Au or Sn over 50µ" (1,27µm) Ni
Current Rating:
Contact: 1.0A @ 30°C
Temperature Rise
Ground Plane: 7.8A @ 30°C
Temperature Rise
Operating Temp Range:
-55°C to +125°C
Voltage Rating:
125 VAC (5mm Stack Height)
Max Cycles:
100
Unmating Force (-RT1 option):
-RT1 option increases
unmating force up to 50%
RoHS Compliant:
Yes
Processing:
Lead-Free Solderable:
Yes
SMT Lead Coplanarity:
(0,10mm) .004" max (030-060)
(0,15mm) .006" max (090-120)
Board Stacking:
For applications requiring
more than two connectors
per board or 4 banks or more,
contact ipg@samtec.com
*Note: –C Plating passes
10 year MFG testing
Note: Some lengths, styles
and options are non-standard,
non-returnable.
HIGH SPEED GROUND PLANE SOCKET
F-211
SPECIFIC OPTION
• 14mm, 15mm, 22mm and
• 30µ" (0,76µm) Gold
• Edge Mount & Guide Posts
• 150 positions per row
Call Samtec.
SPECIFICATIONS
(0,50mm) .0197"
QSH SERIES
30mm stack height
(Caution: Some automatic
placement/inspection
machines may have
component height
restrictions. Please consult
machinery specifi cations.)
(Specify -H plating for Data
Rate cable mating
applications.)
APPLICATION
Board Mates:
QTH
Cable Mates:
HQCD, HQDP,
HFHM2
(See Application
Specifi c note)
QSH
5mm Stack Height
Single-Ended Signaling
Differential Pair Signaling
Differential Pair Signaling
Performance data for other stack heights and complete
test data available at www.samtec.com?QSH or contact
sig@samtec.com
(7,49)
.295
(3,05)
.120
Call Samtec for maximum cycles mated with QTH
(0,89)
.035
DIA
(7,24)
02
01
–01
.285
10 year Mixed Flowing Gas with 50µ" Gold
–030, –060, –090, –120
–020, –040, –060, –080
–DP = (No. of Pairs per Row/20) x
(20,00) .7875
–D = (No. of Pins per Row/30) x
EXTENDED LIFE PRODUCT
(0,76)
(60 total pins per bank = –D)
(20 pairs per bank = –D–DP)
.030
(20,00) .7875 + (1,27) .050
(20,00) .7875 + (1,27) .050
PINS PER ROW
NO. OF PAIRS
Type
–DP
–D
–D
®
(3,81)
(0,50)
.0197
.150
Rated @ 3dB Insertion Loss
WWW.SAMTEC.COM
–RT1
9.5 GHz / 19 Gbps
QSH–030–01–F–D–A–RT1
9 GHz / 18 Gbps
8 GHz / 16 Gbps
TM
(3,76)
.148
DIA
(0,15)
.006
®
QSH–060–01–L–D–DP–A
01
(3,25)
.128
Blade &
Beam Design
–L
ALSO AVAILABLE
Board Spacing Standoffs.
50µ" (1,27µm) min Au
10µ" (0,25µm) min Au
(0,64)
Gold on Signal Pins
over 150µ" (3,81µm)
.025
Ni on Ground Plane
Matte Tin over 50µ"
and Ground Plane,
and Ground Plane,
over 50µ" (1,27µm)
= Electro-Polished
Ni on Signal Pins
on all solder tails
Matte Tin on tails
Matte Tin on tails
= 10µ" (0,25µm)
(1,27µm) min Ni
in contact area,
in contact area,
on Signal Pins
PLATING
= Gold Flash
OPTION
See SO Series.
Selective
–C*
–F
–L
Integral metal plane
for power or ground
STYLE
LEAD
*Processing
QTH
–03
–04
–05
–01
–02
–07
conditions will
affect mated height.
TYPE
= Differential
–D–DP
(–01 only)
= Single-
Ended
WITH QSH*
–D
(11,00) .433
(16,00) .630
(19,00) .748
(25,00) .984
Pair
(5,00) .197
(8,00) .315
HEIGHT
MATED
QSH–060–01–L–D–A–K
A
• Retention pin
option
Pick & Place Pad
(–090 positions
(–090 positions
Polyimide Film
= Tape & Reel
–RT1 option)
positions or
= Retention
(N/A on 120
= (8,25mm)
maximum)
maximum)
= Latching
.325" DIA
–RT1
–TR
Option
Option
OPTION
OTHER
–K
–L

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