QTE-020-01-F-D-A-K Samtec Inc, QTE-020-01-F-D-A-K Datasheet

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QTE-020-01-F-D-A-K

Manufacturer Part Number
QTE-020-01-F-D-A-K
Description
Conn Micro High Speed Terminal Strip HDR 40 POS 0.8mm Solder ST SMD
Manufacturer
Samtec Inc
Type
Micro High Speed Terminal Stripr
Series
QStrip® QTEr
Datasheet

Specifications of QTE-020-01-F-D-A-K

Pitch
0.8 mm
Number Of Rows
2
Number Of Contacts
40
Gender
HDR
Contact Plating
Gold Over Nickel
Termination Method
Solder
Connector Type
Header, Outer Shroud Contacts
Number Of Positions
40
Mounting Type
Surface Mount
Features
Board Guide, Ground Bus (Plane)
Contact Finish
Gold
Contact Finish Thickness
-
Mated Stacking Heights
-
Height Above Board
0.168" (4.27mm)
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
QTE-020-01-F-D-A-K
Manufacturer:
Samtec Inc.
Quantity:
211
Part Number:
QTE-020-01-F-D-A-K-TR
Manufacturer:
Samtec Inc.
Quantity:
450
Part Number:
QTE-020-01-F-D-A-K-TR
Quantity:
320
For complete specifi cations and
recommended PCB layouts see
www.samtec.com?QTE
Insulator Material:
Liquid Crystal
Polymer
Terminal Material:
Phosphor Bronze
Plating:
Au or Sn over 50µ" (1,27µm) Ni
Current Rating:
Contacts: 1.3A @ 95°C
Ground Plane: 10.1A @ 95°C
Operating Temp Range:
-55°C to +125°C
Voltage Rating:
225 VAC mated with QSE
& 5mm Stack Height
Max Cycles: 100
Unmating Force (-RT1 option):
-RT1 option increases
unmating force up to 50%
RoHS Compliant:
Yes
Processing:
Lead–Free Solderable:
Yes
SMT Lead Coplanarity:
(0,10mm) .004" max (020-060)
(0,15mm) .006" max (080)
Board Stacking:
For applications requiring
more than two connectors
per board or 4 banks or more,
contact ipg@samtec.com
*Note: –C Plating passes
10 year MFG testing
Note: Some lengths, styles
and options are non-standard,
non-returnable.
HIGH SPEED GROUND PLANE HEADER
F-211
SPECIFIC OPTION
• 14mm, 15mm, 22mm
• 30µ" (0,76µm) Gold
• Edge Mount
• 100 positions per row
• Guide Posts, Screw Down
Call Samtec.
SPECIFICATIONS
(0,80mm) .0315"
QTE SERIES
and 30mm stack height
(Caution: Some automatic
placement/inspection
machines may have
component height
restrictions. Please
consult machinery
specifi cations.)
(Specify -H plating for
Data Rate cable mating
applications.)
& Friction Lock
APPLICATION
Board Mates:
QSE
Cable Mates:
EQCD, EQSD,
EQDP, EQRF
(See Application
Specifi c note)
.035 DIA
5mm Stack Height
Single-Ended Signaling
Differential Pair Signaling
Differential Pair Signaling
Performance data for other stack heights and complete test data
available at www.samtec.com?QTE or contact sig@samtec.com
QTE
(5,97)
(0,89)
.235
A
Call Samtec for maximum cycles mated with QSE
–020, –040, –060, –080
–014, –028, –042, –056
01
02
(40 total pins per bank = –D)
(14 pairs per bank = –D–DP)
10 year Mixed Flowing Gas with 50µ" Gold
–D–DP = (No. of Positions per Row/14)
(0,76)
.030
(20,00) .7875
–D = (No. of Positions per Row/20)
EXTENDED LIFE PRODUCT
PINS PER ROW
NO. OF PAIRS
(3,30)
.130
x (20,00) .7875
x (20,00) .7875
(0,80)
.0315
®
Type
–DP
(1,57)
–D
–D
.062
DIA
WWW.SAMTEC.COM
–RT1
Rated @ 3dB Insertion Loss
QTE–060–01–L–D–A
TM
8.5 GHz / 17 Gbps
(1,57)
9 GHz / 18 Gbps
8 GHz / 16 Gbps
.062
(0,20)
.008
®
STYLE
Specify
STYLE
LEAD
LEAD
Integral metal plane
for power or ground
chart
from
QTE–014–01–F–D–DP–A
(7,11)
.280
––L
10µ" (0,25µm) min Au
over 50µ" (1,27µm) Ni
(3,81µm) Ni on Signal
Pins in contact area,
(0,64)
Gold on Signal Pins
on Ground Plane in
Matte Tin over 50µ"
.025
Board Spacing Standoffs.
on Signal Pins and
(1,27µm) min Ni on
and Ground Plane,
= Electro-Polished
50µ" (1,27µm) min
Matte Tin on tails
Matte Tin on tails
= 10µ" (0,25µm)
Ground Plane,
Au over 150µ"
all solder tails
contact area,
PLATING
= Gold Flash
OPTION
AVAILABLE
Selective
–C*
See SO Series.
–F
–L
ALSO
Standard
stack heights
from 5mm
to 25mm
Polarized
STYLE
*Processing conditions
LEAD
QTE
–01
–02
–03
–04
–05
–07
will affect mated height.
TYPE
= Differential Pair
= Single-Ended
–D–DP
(–01 only)
–D
(10,27)
(15,25)
(18,26)
(24,24)
(4,27)
(7,26)
.168
.286
.404
.600
.718
.954
A
QTE–014–01–L–D–A–RT1
HEIGHT
(11,00)
(16,00)
(19,00)
(25,00)
A
WITH
QSE*
(5,00)
(8,00)
• E.L.P.
• Retention pin option
.197
.315
.433
.630
.748
.984
option (–C)
TM
Polyimide Film
plating
= Tape & Reel
80 positions)
–RT1 option)
Pick & Place
(N/A on 56 &
(N/A on 56 &
80 positions
or –L (latch)
positions or
= Retention
OPTION
= (7,00mm)
(N/A on 42,
56, 60 & 80
Packaging
Style only)
= Latching
OTHER
.275" DIA
(-01 Lead
–RT1
–TR
option)
Option
Option
–K
–L
Pad

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