YNM05S05-G POWER ONE, YNM05S05-G Datasheet - Page 7

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YNM05S05-G

Manufacturer Part Number
YNM05S05-G
Description
Module DC-DC 1-OUT 0.7525V to 3.63V 5A 5-Pin SMD T/R
Manufacturer
POWER ONE
Type
Step Downr
Datasheet

Specifications of YNM05S05-G

Package
5SMD
Output Current
5 A
Output Voltage
0.7525 to 3.63 V
Input Voltage
5 V
Number Of Outputs
1
Switching Regulator
Yes

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Part Number:
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Overtemperature Protection (OTP)
The
overtemperature condition to protect itself from
overheating caused by operation outside the thermal
derating curves, or operation in abnormal conditions
such as system fan failure. After the converter has
cooled to a safe operating temperature, it will
automatically restart.
Safety Requirements
The
International safety regulatory requirements per
UL60950 and EN60950. The maximum DC voltage
between any two pins is Vin under all operating
conditions. Therefore, the unit has ELV (extra low
voltage) output; it meets SELV requirements under
the condition that all input voltages are ELV.
The converter is not internally fused. To comply with
safety agencies’ requirements, a recognized fuse
with a maximum rating of 15 Amps must be used in
series with the input line.
Characterization
General Information
The converter has been characterized for many
operational aspects, to include thermal derating
(maximum load current as a function of ambient
temperature and airflow) for vertical and horizontal
mounting,
parameters, output ripple and noise, transient
response to load step-change, overload, and short
circuit.
The figures are numbered as Fig. x.y, where x
indicates the different output voltages, and y
associates with specific plots (y = 1 for the vertical
thermal derating, …). For example, Fig. x.1 will refer
to the vertical thermal derating for all the output
voltages in general.
The following pages contain specific plots or
waveforms associated with the converter. Additional
comments for specific data are provided below.
Test Conditions
All data presented were taken with the converter
soldered to a test board, specifically a 0.060” thick
printed wiring board (PWB) with four layers. The top
and bottom layers were not metalized. The two inner
layers, comprised of two-ounce copper, were used to
provide traces for connectivity to the converter.
MCD10190 Rev. 1.0, 21-Jun-10
converter
converter
efficiency,
meets
will
shut
startup
3.0-5.5 VDC Input; 0.7525-3.63 VDC Programmable @ 5 A
North
down
and
American
under
shutdown
and
an
Page 7 of 25
YNM05S05 DC-DC Converter Data Sheet
The lack of metalization on the outer layers as well
as the limited thermal connection ensured that heat
transfer from the converter to the PWB was
minimized. This provides a worst-case but consistent
scenario for thermal derating purposes.
All measurements requiring airflow were made in the
vertical and horizontal wind tunnels using Infrared
(IR)
thermometry.
Ensuring components on the converter do not
exceed their ratings is important to maintaining high
reliability. If one anticipates operating the converter
at or close to the maximum loads specified in the
derating curves, it is prudent to check actual
operating
Thermographic
capability is not available, then thermocouples may
be used. The use of AWG #40 gauge thermocouples
is recommended to ensure measurement accuracy.
Careful routing of the thermocouple leads will further
minimize measurement error. Refer to Fig. E for
optimum measuring thermocouple location.
Thermal Derating
Load current vs. ambient temperature and airflow
rates are given in Figs. x.1 to x.2 for maximum
temperature of 120 °C. Ambient temperature was
varied between 25 °C and 85 °C, with airflow rates
from 30 to 500 LFM (0.15 m/s to 2.5 m/s), and
vertical and horizontal converter mounting.
For each set of conditions, the maximum load
current is defined as the lowest of:
(i) The output current at which any MOSFET
temperature does not exceed a maximum specified
temperature of 120 °C as indicated by the
thermographic image, or
(ii) The maximum current rating of the converter
(5 A).
During normal operation, derating curves with
maximum FET temperature less than or equal to
120 °C should not be exceeded. Temperature on the
PCB at the thermocouple location shown in Fig. E
Fig. E: Location of the thermocouple for thermal testing.
thermography
www.power-one.com
temperatures
imaging
and
is
in
thermocouples
preferable;
the
application.
if
this
for

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