BGA 777L7 E6327 Infineon Technologies, BGA 777L7 E6327 Datasheet - Page 18

• Manufacturer Part Number: BGA 777L7 E6327
• Description: RF Amplifier RF SILICON MMIC
• Manufacturer: Infineon Technologies
• Type: Low Power Single Bandr

Specifications of BGA 777L7 E6327

• Operating Frequency: 2650 MHz
• P1db: 4 dBm
• Noise Figure: 1.2 dB
• Operating Supply Voltage: 2.8 V
• Supply Current: 10 mA
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Package / Case: TSLP-7-1
• Minimum Operating Temperature: - 30 C
• Other names: BGA777L7E6327XT

3.2
Figure 3
Note: Package paddle (Pin 0) has to be RF grounded.
Table 11
Part Number
L1 ... L3
C1 ... C3
RREF
Data Sheet
2500 MHz
V
V
EN
GS
= 0 / 2.8 V
= 0 / 2.8 V
RFIN
3.3nH
UMTS Band 38 Application Circuit Schematic
Application circuit with chip outline (top view)
Parts List
L1
4.1nH
L2
Part Type
Chip inductor
Chip capacitor
Chip resistor
2.4pF
C1
RFIN
VEN
VGS
1
2
3
Biasing & Logic
Circuitry
Manufacturer
Various
Various
Various
BGA777L7 - Low Power Single-Band UMTS LNA
18
7 GND
BGA777L7_Appl_ Band38_BlD.vsd
UMTS Band 38 Application Circuit Schematic
Size
0402
0402
0402
Application Circuit and Block Diagram
RFOUT
RREF
VCC
6
5
4
3.6nH
Comment
Wirewound, Q ≈ 50
L3
10nF
8.2kΩ
R
C3
REF
V3.0, 2009-07-02
V
CC
1.2pF
= 2.8 V
C2
RFOUT
2500 MHz