BGA 777L7 E6327 Infineon Technologies, BGA 777L7 E6327 Datasheet - Page 20
BGA 777L7 E6327
Manufacturer Part Number
BGA 777L7 E6327
Description
RF Amplifier RF SILICON MMIC
Manufacturer
Infineon Technologies
Type
Low Power Single Bandr
Datasheet
1.BGA_777L7_E6327.pdf
(24 pages)
Specifications of BGA 777L7 E6327
Operating Frequency
2650 MHz
P1db
4 dBm
Noise Figure
1.2 dB
Operating Supply Voltage
2.8 V
Supply Current
10 mA
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Package / Case
TSLP-7-1
Minimum Operating Temperature
- 30 C
Other names
BGA777L7E6327XT
3.5
Figure 5
Figure 6
Data Sheet
Application Board
Application board layout on 3-layer FR4. Top layer thickness: 0.2 mm, bottom layer thickness:
0.8 mm, 35 µm Cu metallization, gold plated. Board size: 21 x 19 mm
Cross-section view of application board
BGA777L7 - Low Power Single-Band UMTS LNA
20
Application Circuit and Block Diagram
Application Board
V3.0, 2009-07-02