MC12095DR2 ON Semiconductor, MC12095DR2 Datasheet

Prescaler 2.5GHz Low Power

MC12095DR2

Manufacturer Part Number
MC12095DR2
Description
Prescaler 2.5GHz Low Power
Manufacturer
ON Semiconductor
Datasheet

Specifications of MC12095DR2

Division
2/4
Mounting Style
SMD/SMT
Package / Case
SOIC-8
Maximum Operating Frequency
2500 MHz
Minimum Operating Frequency
500 MHz
Supply Voltage (min)
2.7 V
Supply Voltage (max)
5.5 V
Operating Supply Voltage
3.3 V, 5 V
Minimum Operating Temperature
- 40 C
Maximum Operating Temperature
+ 85 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC12095DR2
Manufacturer:
ON
Quantity:
1 000
Part Number:
MC12095DR2G
Manufacturer:
TOSHIBA
Quantity:
6 227
Part Number:
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Manufacturer:
ON/安森美
Quantity:
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MC12095
2.5 GHz Low Power
Prescaler With Stand-By
Mode
Description
frequency division of a 2.5 GHz high frequency input signal.
MOSAIC V™ technology is utilized to achieve low power dissipation
of 24 mW at a minimum supply voltage of 2.7 V.
2.0 pF (typical) high impedance load. If additional drive is required
for the prescaler output, an external resistor can be added in parallel
from the OUT pin to GND to increase the output power. Care must be
taken not to exceed the maximum allowable current through the
output.
÷2 or ÷4. Stand−By mode is available to reduce current drain to
100 mA typical when the standby pin SB is switched LOW disabling
the prescaler.
Features
Table 1. FUNCTIONAL TABLE
1. SW: H = (V
2. SB: H = 2.0 V to V
© Semiconductor Components Industries, LLC, 2008
August, 2008 − Rev. 7
The MC12095 is a single modulus prescaler for low power
On−chip output termination provides output current to drive a
Divide ratio control input (SW) selects the required divide ratio of
2.5 GHz Toggle Frequency
Supply Voltage 2.7 V to 5.5 Vdc
Low Power 8.7 mA Typical
Operating Temperature −40°C to 85°C
Divide by 2 or 4 Selected by the SW Pin
Pb−Free Packages are Available
SW
H
L
50 W
C1
CC
− 0.4 V) to V
C2
CC
; L = GND to 0.8 V
Figure 1. AC Test Circuit
IN
IN
CC
; L = OPEN
GND
V
CC
Divide Ratio
OUT
SW
SB
2
4
C3
C4
V
CC
EXTERNAL
COMPONENTS
C1 = C2 = 1000 pF
C3 = 0.1 mF
C4 = 2.0 pF
= 2.7 to 5.5 V
1
See detailed ordering and shipping information in the package
dimensions section on page 6 of this data sheet.
8
A
L
Y
W
G
(Note: Microdot may be in either location)
1
ORDERING INFORMATION
PIN CONNECTIONS
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
http://onsemi.com
OUT
V
NC
CC
IN
CASE 506AA
MN SUFFIX
CASE 751
(Top View)
D SUFFIX
1
2
3
4
DFN8
SO−8
Publication Order Number:
8
7
6
5
IN
SB
SW
Gnd
DIAGRAMS
8
1
MARKING
1
12095
ALYW
MC12095/D
G
4

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MC12095DR2 Summary of contents

Page 1

... On−chip output termination provides output current to drive a 2.0 pF (typical) high impedance load. If additional drive is required for the prescaler output, an external resistor can be added in parallel from the OUT pin to GND to increase the output power. Care must be taken not to exceed the maximum allowable current through the output ...

Page 2

Table 2. ATTRIBUTES Internal Input Pulldown Resistor Internal Input Pullup Resistor ESD Protection Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1) Flammability Rating Transistor Count Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test 1. For additional information, see ...

Page 3

By 2 Mode 25°C, V Figure 2. Typical Minimum Input Sensitivity versus Input Frequency http://onsemi.com 1500 1700 1900 2100 Input Frequency (MHz ...

Page 4

SPEC 600 400 200 0 500 750 1000 1250 (Divide By 2 Mode, V Figure 3. Typical Output Amplitude versus Frequency Over Temperature 1800 1600 1400 1200 1000 800 SPEC 600 400 200 0 ...

Page 5

Figure 5. Input Impedance versus Frequency 100 50 0 −50 −100 −150 −200 500 700 900 1100 1300 Figure 6. Input Impedance versus Frequency http://onsemi.com 1500 1700 1900 ...

Page 6

... ORDERING INFORMATION Device MC12095D MC12095DG MC12095DR2 MC12095DR2G MC12095MNR4 MC12095MNR4G †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Package SOIC−8 SOIC−8 (Pb−Free) SOIC−8 SOIC−8 (Pb− ...

Page 7

... G C SEATING PLANE −Z− 0.25 (0.010 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. PACKAGE DIMENSIONS SOIC−8 NB CASE 751−07 ISSUE 0.10 (0.004 SOLDERING FOOTPRINT* 1 ...

Page 8

... Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303− ...

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