2PB709ASW,115 NXP Semiconductors, 2PB709ASW,115 Datasheet
2PB709ASW,115
Specifications of 2PB709ASW,115
2PB709ASW T/R
934057080115
Related parts for 2PB709ASW,115
2PB709ASW,115 Summary of contents
Page 1
V, 100 mA PNP general-purpose transistor Rev. 01 — 19 March 2007 1. Product profile 1.1 General description PNP general-purpose transistor in a small SOT23 (TO-236AB) Surface-Mounted Device (SMD) plastic package. NPN complement: 2PD601ART. 1.2 Features I General-purpose ...
Page 2
... NXP Semiconductors 3. Ordering information Table 3. Type number 2PB709ART 4. Marking Table 4. Type number 2PB709ART [ made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China 5. Limiting values Table 5. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol V CBO V CEO V EBO tot ...
Page 3
... NXP Semiconductors Fig 1. Power derating curve 6. Thermal characteristics Table 6. Symbol R th(j-a) R th(j-sp) [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. 2PB709ART_1 Product data sheet 300 P tot (mW) 200 100 FR4 PCB, standard footprint Thermal characteristics Parameter thermal resistance from ...
Page 4
... NXP Semiconductors th(j-a) 0.75 (K/W) 0.50 0. 0.20 0.10 0.05 0. FR4 PCB, standard footprint Fig 2. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT23 (TO-236AB); typical values 7. Characteristics Table unless otherwise specified. amb Symbol Parameter I CBO ...
Page 5
... NXP Semiconductors 500 h FE (1) 400 300 (2) 200 (3) 100 ( 150 C amb ( amb ( amb Fig 3. DC current gain as a function of collector current; typical values 1.3 V BEsat (V) 0.9 (1) (2) 0.5 ( amb ( amb ( 150 C amb Fig 5. Base-emitter saturation voltage as a function of collector current; typical values ...
Page 6
... NXP Semiconductors 8. Package outline Fig 7. Package outline SOT23 (TO-236AB) 9. Packing information Table 8. The indicated -xxx are the last three digits of the 12NC ordering code. Type number 2PB709ART [1] For further information and the availability of packing methods, see 2PB709ART_1 Product data sheet 45 V, 100 mA PNP general-purpose transistor 3 ...
Page 7
... NXP Semiconductors 10. Soldering Fig 8. Reflow soldering footprint SOT23 (TO-236AB) 4.60 Fig 9. Wave soldering footprint SOT23 (TO-236AB) 2PB709ART_1 Product data sheet 2.90 2.50 0.85 2 3.00 1.30 0.85 3 0.50 (3x) 0.60 (3x) 1.00 3.30 3.40 1.20 (2x 4.00 1.20 3 2.80 4.50 Rev. 01 — 19 March 2007 ...
Page 8
... NXP Semiconductors 11. Revision history Table 9. Revision history Document ID Release date 2PB709ART_1 20070319 2PB709ART_1 Product data sheet 45 V, 100 mA PNP general-purpose transistor Data sheet status Change notice Product data sheet - Rev. 01 — 19 March 2007 2PB709ART Supersedes - © NXP B.V. 2007. All rights reserved. ...
Page 9
... For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail ...
Page 10
... NXP Semiconductors 14. Contents 1 Product profi 1.1 General description 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data Pinning information . . . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6 9 Packing information Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 11 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 8 12 Legal information ...