PBSS5350D,135 NXP Semiconductors, PBSS5350D,135 Datasheet
PBSS5350D,135
Specifications of PBSS5350D,135
PBSS5350D /T3
PBSS5350D /T3
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PBSS5350D,135 Summary of contents
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PBSS5350D PNP low VCEsat (BISS) transistor Rev. 5 — 23 March 2011 1. Product profile 1.1 General description PNP low V SOT457 (SC-74) Surface-Mounted Device (SMD) plastic package. NPN complement: PBSS4350D 1.2 Features and benefits ...
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... NXP Semiconductors 2. Pinning information Table 2. Pinning information Pin Symbol Description 1 C collector 2 C collector 3 B base 4 E emitter 5 C collector 6 C collector 3. Ordering information Table 3. Ordering information Type number Package Name PBSS5350D TSOP6 4. Marking Table 4. Marking codes Type number PBSS5350D [ placeholder for manufacturing site code ...
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... NXP Semiconductors 5. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter V collector-base voltage CBO V collector-emitter voltage CEO V emitter-base voltage EBO I collector current C I peak collector current CM I peak base current BM P total power dissipation ...
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... NXP Semiconductors 7. Characteristics Table 7. Characteristics Symbol Parameter I collector-base cut-off CBO current I emitter-base cut-off EBO current h DC current gain FE V collector-emitter CEsat saturation voltage R collector-emitter CEsat saturation resistance V base-emitter saturation BEsat voltage V base-emitter turn-on BEon voltage f transition frequency T C collector capacitance c PBSS5350D ...
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... NXP Semiconductors 1000 h FE 800 (1) 600 (2) 400 (3) 200 0 −1 −10 −1 − ( 150 °C amb ( °C amb ( -55 °C amb Fig 1. DC current gain as a function of collector current; typical values –5 I (mA) = –250 –225 (A) –200 –4 –3 –2 –1 0 0.0 –0.4 –0 ° ...
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... NXP Semiconductors −1.4 V BEsat (V) −1.2 −1.0 (1) −0.8 (2) −0.6 (3) −0.4 −0.2 −1 −10 −1 − ( -55 °C amb ( °C amb ( 150 °C amb Fig 5. Base-emitter saturation voltage as a function of collector current; typical values ( 150 °C amb ( °C amb ( -55 °C amb Fig 7. Collector-emitter saturation resistance as a function of collector current; typical values ...
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... NXP Semiconductors 8. Package outline Plastic surface-mounted package (TSOP6); 6 leads y 6 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) UNIT 0.1 0.40 1.1 0.26 mm 0.013 0.25 0.9 0.10 OUTLINE VERSION IEC SOT457 Fig 8. Package outline SOT457 (TSOP6) PBSS5350D Product data sheet scale ...
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... NXP Semiconductors 9. Soldering 0.95 3.3 2.825 0.95 Fig 9. Reflow soldering footprint for SOT457 (TSOP6) 1.475 5.05 1.475 Fig 10. Wave soldering footprint for SOT457 (TSOP6) PBSS5350D Product data sheet 3.45 1.95 0.45 (6×) 0.7 (6×) 0.8 (6×) 2.4 5.3 1.45 (6×) 2.85 All information provided in this document is subject to legal disclaimers. Rev. 5 — ...
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... Document ID Release date PBSS5350D v.5 20110323 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • 1 “Product • Figures • ...
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... Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights ...
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... NXP Semiconductors 13. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . .1 1.1 General description . . . . . . . . . . . . . . . . . . . . . .1 1.2 Features and benefits . . . . . . . . . . . . . . . . . . . . .1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . .1 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . .2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . .2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 5 Limiting values Thermal characteristics . . . . . . . . . . . . . . . . . . .3 7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . .4 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . .7 9 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8 10 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . .9 11 Legal information ...