LT1739IUE#PBF Linear Technology, LT1739IUE#PBF Datasheet - Page 18
LT1739IUE#PBF
Manufacturer Part Number
LT1739IUE#PBF
Description
Manufacturer
Linear Technology
Datasheet
1.LT1739IUEPBF.pdf
(20 pages)
Specifications of LT1739IUE#PBF
Power Supply Requirement
Dual
Slew Rate
200V/us
Pin Count
12
Lead Free Status / RoHS Status
Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
LT1739
PACKAGE DESCRIPTIO
18
6.60 0.10
(.0036 – .0079)
0.09 – 0.20
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
2. DIMENSIONS ARE IN
3. DRAWING NOT TO SCALE
4.50 0.10
RECOMMENDED SOLDER PAD LAYOUT
(.169 – .177)
4.30 – 4.50*
(.018 – .030)
0.45 – 0.75
SEE NOTE 4
(.195)
MILLIMETERS
4.95
U
(INCHES)
0.65 BSC
20-Lead Plastic TSSOP (4.4mm)
(Reference LTC DWG # 05-08-1663)
0.45 0.05
Exposed Pad Variation CA
(.108)
2.74
1.05 0.10
0 – 8
*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
4. RECOMMENDED MINIMUM PCB METAL SIZE
SHALL NOT EXCEED 0.150mm (.006") PER SIDE
FE Package
FOR EXPOSED PAD ATTACHMENT
(.0256)
0.65
BSC
20 1918 17 16 15
1
(.0077 – .0118)
0.195 – 0.30
2
3 4 5 6 7 8 9 10
(.252 – .260)
6.40 – 6.60*
(.195)
4.95
14 13
12
11
FE20 (CA) TSSOP 0203
(.002 – .006)
0.05 – 0.15
(.108)
(.047)
2.74
1.20
MAX
6.40
BSC
1739fas, sn1739