MCZ33889BEGR2 Freescale, MCZ33889BEGR2 Datasheet - Page 57
MCZ33889BEGR2
Manufacturer Part Number
MCZ33889BEGR2
Description
Manufacturer
Freescale
Datasheet
1.MCZ33889BEGR2.pdf
(60 pages)
Specifications of MCZ33889BEGR2
Number Of Transceivers
1
Standard Supported
CAN 2.0
Operating Supply Voltage (max)
18V
Operating Supply Voltage (min)
5.5V
Package Type
SOIC W
Supply Current
45mA
Operating Temperature (max)
125C
Operating Temperature (min)
-40C
Operating Temperature Classification
Automotive
Mounting
Surface Mount
Pin Count
28
Lead Free Status / RoHS Status
Compliant
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Device on Thermal Test Board
Analog Integrated Circuit Device Data
Freescale Semiconductor
Material:
Outline:
Area A:
Ambient Conditions:
V2CTRL
VDD1
VSUP
GND
GND
GND
GND
RST
HS1
INT
RX
TX
L0
L1
18.0 mm x 7.5 mm Body
33889 Pin Connections
28-Pin SOICW
1.27 mm Pitch
1
2
3
4
5
6
7
8
9
10
11
12
13
14
Single layer printed circuit board
FR4, 1.6 mm thickness
Cu traces, 0.07 mm thickness
80 mm x 100 mm board area,
including edge connector for thermal
testing
Cu heat-spreading areas on board
surface
Natural convection, still air
28
27
26
25
24
23
22
21
20
19
18
17
16
15
WDOG
CS
MOSI
MISO
SCLK
GND
GND
GND
GND
CANL
CANH
RTL
RTH
V2
Figure 24. Thermal Test Board
A
Table 35. Thermal Resistance Performance
ambient air.
R
θJA
Resistance
Thermal
R
is the thermal resistance between die junction and
θ
JA
Area A (mm
THERMAL ADDENDUM (REV 2.0)
300
600
ADDITIONAL DOCUMENTATION
0
2
)
(°C/W)
69
53
48
33889
57
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