EXC-3BB601H Panasonic - ECG, EXC-3BB601H Datasheet - Page 7

• Manufacturer Part Number: EXC-3BB601H
• Description: BEAD CORE 600 OHM 100MA 0603 SMD
• Manufacturer: Panasonic - ECG
• Series: EXC3Br

Specifications of EXC-3BB601H

• Impedance @ Frequency: 600 Ohm @ 100MHz
• Current Rating: 100mA
• Dc Resistance (dcr): 800.0 mOhm Max
• Filter Type: Differential Mode - Single
• Number Of Lines: 1
• Package / Case: 0603 (1608 Metric)
• Mounting Type: Surface Mount
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: EXC3BB601H; P10189TR

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Recommendations and precautions are described below.
<Repair with hand soldering>
● Preheat with a blast of hot air or similar method. Use a soldering iron with a tip temperature of 350 °C or less. Solder
● Never touch this product with the tip of a soldering iron.
The following are precautions for individual products. Please also refer to the common precautions shown on page 4
of this catalog.
1. Use rosin-based fl ux or halogen-free fl ux.
2. For cleaning, use an alcohol-based cleaning agent. Before using any other type, consult with our sales per son
3. Do not apply shock to Chip Bead Cores (hereafter called the bead cores) or pinch them with a hard tool (e.g.
4. Store the bead cores in a location with a temperature ranging from -5 °C to +40 °C and a rel a tive humidity of
5. Use the bead cores within a year (EXC3B Type: within half a year) after the date of the out go ing in spec tion
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Recommended Land Pattern Dimensions in mm (not to scale)
Recommended Soldering Conditions
● Recommended soldering conditions for refl ow
● Flow soldering
each electrode for 3 seconds or less.
in advance.
pliers and tweezers). Otherwise, their bodies may be chipped, affecting their per for mance.
Excessive mechanical stress may damage the bead cores. Handle with care.
40 % to 60 %, where there are no rapid changes in temperature or humidity.
indicated on the packages.
Safety Precautions
· Refl ow soldering shall be performed a maximum of
· Please contact us for additional information when
· Please measure the temperature of the terminals
· Flow soldering may cause this product to come off because the adhesiveness of the product element is low.
two times.
used in conditions other than those specifi ed.
and study every kind of solder and printed circuit
board for solderability be fore ac tu al use.
Please consult our sales representative in advance about fl ow soldering.
Preheating
C
Peak
Time
A
B
Heating
EXCML45A910H
EXCML32A680U
EXCML20A390U
EXCML16A270U
EXC3B
EXCCL4532U1
EXCCL3225U1
EXCCL3216U1
Part Number
– 247 –
For soldering (Example : Sn-37Pb)
For lead-free soldering (Example : Sn/3Ag/0.5Cu)
Preheating
Main heating
Peak
Preheating
Main heating
Peak
H
0.8 to 1.2
2.6 to 3
1.6 to 2
0.6 to 1
0.8 to 1
1.7
1.7
A
3
140 °C to 160 °C
150 °C to 170 °C
Above 200 °C
Above 230 °C
Temperature
Temperature
235 ± 10 °C
max. 260 °C
5.5 to 6.5
2 to 2.6
4 to 5
3 to 4
2 to 3
5.4
4.1
4.1
B
Chip Bead Cores
60 s to 120 s
60 s to 120 s
30 s to 40 s
30 s to 40 s
max. 10 s
max. 10 s
1.2 to 1.6
1.2 to 1.6
1 to 1.2
0.8 to 1
0.8 to 1
Time
Time
2.8
2.1
1.2
00
C
Sep. 2010
(mm)