PIC16F726-E/SO Microchip Technology, PIC16F726-E/SO Datasheet - Page 11

• Manufacturer Part Number: PIC16F726-E/SO
• Description: 14KB Flash Program, 1.8V-5.5V, 16MHz Internal Oscillator, 8b ADC, CCP, I2C/SPI,
• Manufacturer: Microchip Technology
• Series: PIC® XLP™ 16Fr

Specifications of PIC16F726-E/SO

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 25
• Program Memory Size: 14KB (8K x 14)
• Program Memory Type: FLASH
• Ram Size: 368 x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 5.5 V
• Data Converters: A/D 11x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 28-SOIC (7.5mm Width)
• Processor Series: PIC16F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 368 B
• Interface Type: I2C, SCI, SPI
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 25
• Number Of Timers: 3
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8 bit, 11 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AC164112 - VOLTAGE LIMITER MPLAB ICD2 VPPICE2000 - EMULATOR MPLAB-ICE 2000 POD
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

Table of Contents
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
10.0 Fixed Voltage Reference......................................................................................................................................................... 109
11.0 Timer0 Module ........................................................................................................................................................................ 111
12.0 Timer1 Module with Gate Control............................................................................................................................................ 115
13.0 Timer2 Module ........................................................................................................................................................................ 127
14.0 Capacitive Sensing Module..................................................................................................................................................... 129
15.0 Capture/Compare/PWM (CCP) Module .................................................................................................................................. 135
16.0 Addressable Universal Synchronous Asynchronous Receiver Transmitter (AUSART) .......................................................... 145
17.0 SSP Module Overview ............................................................................................................................................................ 167
18.0 Program Memory Read ........................................................................................................................................................... 189
19.0 Power-Down Mode (Sleep) ..................................................................................................................................................... 193
20.0 In-Circuit Serial Programming™ (ICSP™) .............................................................................................................................. 195
21.0 Instruction Set Summary ......................................................................................................................................................... 197
22.0 Development Support.............................................................................................................................................................. 207
23.0 Electrical Specifications........................................................................................................................................................... 211
24.0 DC and AC Characteristics Graphs and Charts ...................................................................................................................... 241
25.0 Packaging Information............................................................................................................................................................. 277
Appendix A: Data Sheet Revision History......................................................................................................................................... 291
Appendix B: Migrating From Other PIC
The Microchip Web Site .................................................................................................................................................................... 299
Customer Change Notification Service ............................................................................................................................................. 299
Customer Support ............................................................................................................................................................................. 299
Reader Response ............................................................................................................................................................................. 300
Product Identification System ............................................................................................................................................................ 301
© 2009 Microchip Technology Inc.
Device Overview ....................................................................................................................................................................... 13
Memory Organization ................................................................................................................................................................ 19
Resets ....................................................................................................................................................................................... 33
Interrupts ................................................................................................................................................................................... 43
Low Dropout (LDO) Voltage Regulator ..................................................................................................................................... 51
I/O Ports .................................................................................................................................................................................... 53
Oscillator Module....................................................................................................................................................................... 89
Device Configuration ................................................................................................................................................................. 95
Analog-to-Digital Converter (ADC) Module ............................................................................................................................... 99
®
Devices............................................................................................................................. 291
PIC16F72X/PIC16LF72X
DS41341E-page 11