PIC24HJ64GP510A-E/PF Microchip Technology, PIC24HJ64GP510A-E/PF Datasheet - Page 290

16 Bit MCU 40MIPS 64KB FLASH 100 TQFP 14x14x1mm TRAY

PIC24HJ64GP510A-E/PF

Manufacturer Part Number
PIC24HJ64GP510A-E/PF
Description
16 Bit MCU 40MIPS 64KB FLASH 100 TQFP 14x14x1mm TRAY
Manufacturer
Microchip Technology
Series
PIC® 24Hr

Specifications of PIC24HJ64GP510A-E/PF

Core Processor
PIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
CAN, I²C, IrDA, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number Of I /o
85
Program Memory Size
64KB (22K x 24)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 32x10b/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC24HJ64GP510A-E/PF
Manufacturer:
MICROCHIP
Quantity:
12 000
Part Number:
PIC24HJ64GP510A-E/PF
Manufacturer:
Microchip Technology
Quantity:
10 000
PIC24HJXXXGPX06A/X08A/X10A
DS70592B-page 290
100-Lead Plastic Thin Quad Flatpack (PT) – 12x12x1 mm Body, 2.00 mm Footprint [TQFP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Chamfers at corners are optional; size may vary.
3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
NOTE 1
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
c
e
b
β
Number of Leads
Lead Pitch
Overall Height
Molded Package Thickness
Standoff
Foot Length
Footprint
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
N
1 23
D
D1
Dimension Limits
Preliminary
E1
φ
L
NOTE 2
Units
A2
A1
E1
D1
L1
N
D
e
A
L
E
b
α
β
φ
c
E
A
A1
MIN
0.95
0.05
0.45
0.09
0.13
11°
11°
L1
MILLIMETERS
14.00 BSC
14.00 BSC
12.00 BSC
12.00 BSC
0.40 BSC
1.00 REF
NOM
1.00
0.60
0.18
3.5°
100
12°
12°
Microchip Technology Drawing C04-100B
 2009 Microchip Technology Inc.
MAX
1.20
1.05
0.15
0.75
0.20
0.23
13°
13°
A2
α

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