PIC24HJ64GP510A-E/PF Microchip Technology, PIC24HJ64GP510A-E/PF Datasheet - Page 296

• Manufacturer Part Number: PIC24HJ64GP510A-E/PF
• Description: 16 Bit MCU 40MIPS 64KB FLASH 100 TQFP 14x14x1mm TRAY
• Manufacturer: Microchip Technology
• Series: PIC® 24Hr

Specifications of PIC24HJ64GP510A-E/PF

• Core Processor: PIC
• Core Size: 16-Bit
• Speed: 40 MIPs
• Connectivity: CAN, I²C, IrDA, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number Of I /o: 85
• Program Memory Size: 64KB (22K x 24)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 32x10b/12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

PIC24HJXXXGPX06A/X08A/X10A
APPENDIX B:
Revision A (April 2009)
This is the initial release of this document.
TABLE B-1:
DS70592B-page 296
“High-Performance, 16-Bit
Microcontrollers”
Section 10.0 “Power-Saving Features”
Section 11.0 “I/O Ports”
Section 18.0 “Universal Asynchronous
Receiver Transmitter (UART)”
Section 20.0 “10-Bit/12-Bit Analog-to-
Digital Converter (ADC)”
Section 21.0 “Special Features”
Section 24.0 “Electrical Characteristics”
Section 25.0 “High Temperature Electrical
Characteristics”
“Product Identification System”
Section Name
MAJOR SECTION UPDATES
REVISION HISTORY
Added information on high temperature operation (see “Operating
Range:”).
Updated the last paragraph to clarify the number of cycles that occur
prior to the start of instruction execution (see Section 10.2.2 “Idle
Mode”).
Changed the reference to digital-only pins to 5V tolerant pins in the
second paragraph of Section 11.2 “Open-Drain Configuration”.
Updated the two baud rate range features to: 10 Mbps to 38 bps at
40 MIPS.
Updated the ADCx block diagram (see Figure 20-1).
Updated the second paragraph and removed the fourth paragraph in
Section 21.1 “Configuration Bits”.
Updated the Device Configuration Register Map (see Table 21-1).
Updated the Absolute Maximum Ratings for high temperature and
added Note 4.
Updated Power-Down Current parameters DC60d, DC60a, DC60b,
and DC60d (see Table 24-7).
Added I2Cx Bus Data Timing Requirements (Master Mode)
parameter IM51 (see Table 24-32).
Updated the SPIx Module Slave Mode (CKE = 1) Timing
Characteristics (see Figure 24-12).
Updated the Internal LPRC Accuracy parameters (see Table 24-18
and Table 24-19).
Updated the ADC Module Specifications (12-bit Mode) parameters
AD23a and AD24a (see Table 24-36).
Updated the ADC Module Specifications (10-bit Mode) parameters
AD23b and AD24b (see Table 24-37).
Added new chapter with high temperature specifications.
Added the “H” definition for high temperature.
Preliminary
Revision B (October 2009)
The revision includes the following global update:
• Added Note 2 to the shaded table that appears at
This revision also includes minor typographical and
formatting changes throughout the data sheet text.
All other major changes are referenced by their
respective section in the following table.
the beginning of each chapter. This new note
provides information regarding the availability of
registers and their associated bits
Update Description
 2009 Microchip Technology Inc.