SC16C852VIET,515 NXP Semiconductors, SC16C852VIET,515 Datasheet - Page 48
SC16C852VIET,515
Manufacturer Part Number
SC16C852VIET,515
Description
Manufacturer
NXP Semiconductors
Datasheet
1.SC16C852VIET515.pdf
(55 pages)
Specifications of SC16C852VIET,515
Transmitter And Receiver Fifo Counter
Yes
Data Rate
5Mbps
Mounting
Surface Mount
Operating Temperature (min)
-40C
Operating Temperature (max)
85C
Operating Temperature Classification
Industrial
Number Of Channels
2
Lead Free Status / RoHS Status
Compliant
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Fig 23. Package outline SOT912-1 (TFBGA36)
SC16C852V
Product data sheet
TFBGA36: plastic thin fine-pitch ball grid array package; 36 balls; body 3.5 x 3.5 x 0.8 mm
DIMENSIONS (mm are the original dimensions)
UNIT
mm
SOT912-1
VERSION
OUTLINE
max
1.15
A
0.25
0.15
A
ball A1
index area
ball A1
index area
1
0.90
0.75
A
2
D
C
B
A
F
E
IEC
- - -
0.35
0.25
b
1
e
1/2 e
2
3.6
3.4
D
3
e
D
1
4
3.6
3.4
JEDEC
E
Dual UART with 128-byte FIFOs, IrDA, and XScale VLIO bus interface
All information provided in this document is subject to legal disclaimers.
- - -
b
5
0
REFERENCES
0.5
6
e
Rev. 5 — 21 January 2011
1/2 e
2.5
e
1
e
B A
w
v
e
E
M
M
JEITA
2
2.5
e
- - -
2
C
C
scale
2.5
A
0.15
B
v
0.05
w
A
0.08
y
A
5 mm
2
A
0.1
1
y
1
y
1
C
PROJECTION
detail X
EUROPEAN
SC16C852V
X
C
y
© NXP B.V. 2011. All rights reserved.
ISSUE DATE
05-08-09
05-09-01
SOT912-1
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