MT41J256M8HX-15E:D Micron Technology Inc, MT41J256M8HX-15E:D Datasheet - Page 73

• Manufacturer Part Number: MT41J256M8HX-15E:D
• Description: MICMT41J256M8HX-15E:D 2GB:X4,X8,X16 DDR3
• Manufacturer: Micron Technology Inc
• Type: DDR3 SDRAMr
• Series: -r

Specifications of MT41J256M8HX-15E:D

• Organization: 256Mx8
• Address Bus: 18b
• Maximum Clock Rate: 1.333GHz
• Operating Supply Voltage (typ): 1.5V
• Package Type: FBGA
• Operating Temp Range: 0C to 95C
• Operating Supply Voltage (max): 1.575V
• Operating Supply Voltage (min): 1.425V
• Supply Current: 165mA
• Pin Count: 78
• Mounting: Surface Mount
• Operating Temperature Classification: Commercial
• Format - Memory: RAM
• Memory Type: DDR3 SDRAM
• Memory Size: 2G (256M x 8)
• Speed: 667MHz
• Interface: Parallel
• Voltage - Supply: 1.425 V ~ 1.575 V
• Operating Temperature: 0°C ~ 95°C
• Package / Case: 78-TFBGA
• Lead Free Status / RoHS Status: Compliant

Table 56:
Parameter
ZQCL command: Long
calibration time
ZQCS command: Short calibration time
Exit reset from CKE HIGH to a valid command
Begin power supply ramp to power supplies
stable
RESET# LOW to power supplies stable
RESET# LOW to I/O and R
REFRESH-to-ACTIVATE or REFRESH command
period
Maximum refresh
period
Maximum average
periodic refresh
Exit self refresh to commands not requiring a
locked DLL
Exit self refresh to commands requiring a
locked DLL
Minimum CKE low pulse width for self refresh
entry to self refresh exit timing
Valid clocks after self refresh entry or power-
down entry
Valid clocks before self refresh exit, power-
down exit, or reset exit
Electrical Characteristics and AC Operating Conditions (Sheet 4 of 6)
Notes: 1–8 apply to the entire table; notes appear on page 76
POWER-UP and RESET
operation
Normal operation
T
T
T
T
C
TT
C
C
C
> 85°C
≤ 85°C
≤ 85°C
> 85°C
High-Z
Symbol
t
t
t
t
t
t
ZQ
t
CKSRX
ZQ
t
XSDLL
CKESR
CKSRE
V
t
t
t
t
ZQ
t
REFI
XPR
t
RPS
RFC
IOz
DDPR
XS
–
OPER
INIT
CS
Initialization and Reset Timing
Min
512
256
64
MIN = 160; MAX = 9 ×
DDR3-800
Self Refresh Timing
Calibration Timing
Refresh Timing
Max
–
–
–
MIN = greater of 5CK or
MIN = greater of 5CK or
MIN = greater of 5CK or 10ns; MAX = n/a
MIN = greater of 5CK or 10ns; MAX = n/a
MIN =
Min
512
256
DDR3-1066
64
MIN =
t
MIN = n/a; MAX = 200
REFI (REFRESH-to-REFRESH command period)
t
MIN = n/a; MAX = 20
MIN = 0; MAX = 200
CKE (MIN) + CK; MAX = n/a
t
7.8 (64ms/8,192)
3.9 (32ms/8,192)
DLLK (MIN); MAX = n/a
Max
–
–
–
64 (1X)
32 (2X)
t
t
RFC + 10ns; MAX = n/a
RFC + 10ns; MAX = n/a
Min
512
256
DDR3-1333
64
Max
–
–
–
Min
512
256
DDR3-1600
64
Max
–
–
–
Units Notes
CK
ms
CK
CK
CK
CK
CK
CK
CK
ms
ms
ms
CK
ns
ns
µs
µs
35
36
36
36
36
28