ISP1760ET,557 NXP Semiconductors, ISP1760ET,557 Datasheet - Page 98

• Manufacturer Part Number: ISP1760ET,557
• Manufacturer: NXP Semiconductors

Specifications of ISP1760ET,557

• Package Type: TFBGA
• Pin Count: 128
• Lead Free Status / RoHS Status: Compliant

NXP Semiconductors
15. Package outline
Fig 23. Package outline SOT425-1 (LQFP128)
ISP1760_4
Product data sheet
LQFP128: plastic low profile quad flat package; 128 leads; body 14 x 20 x 1.4 mm
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
103
128
OUTLINE
VERSION
SOT425-1
102
1
max.
y
1.6
A
0.15
0.05
A
e
pin 1 index
1
1.45
1.35
A
2
136E28
IEC
0.25
A
3
b
0.27
0.17
p
b
p
H
D
D
0.20
0.09
w
c
M
MS-026
JEDEC
20.1
19.9
D
(1)
REFERENCES
Rev. 04 — 4 February 2008
14.1
13.9
E
(1)
0
0.5
Z D
e
X
JEITA
22.15
21.85
H
D
65
38
39
64
scale
16.15
15.85
5
H
Z E
E
B
b
e
w
p
v
v
L
1
M
M
M
Embedded Hi-Speed USB host controller
A
E
B
A
0.75
0.45
L
H
p
10 mm
E
0.2
v
A
A
0.12
2
w
PROJECTION
EUROPEAN
A
1
0.1
y
detail X
Z
0.81
0.59
D
(1)
© NXP B.V. 2008. All rights reserved.
Z
0.81
0.59
ISP1760
E
(1)
ISSUE DATE
L
L
00-01-19
03-02-20
p
7
0
o
o
SOT425-1
(A )
3
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