STF202-22T1G ON Semiconductor, STF202-22T1G Datasheet - Page 6

IC FILTER USB ESD PROTECT 6TSOP

STF202-22T1G

Manufacturer Part Number
STF202-22T1G
Description
IC FILTER USB ESD PROTECT 6TSOP
Manufacturer
ON Semiconductor
Series
STF202-22r
Datasheet

Specifications of STF202-22T1G

Resistance (ohms)
22
Capacitance
68pF
Power (watts)
0.2W, 1/5W
Package / Case
SC-74-6
Resistance In Ohms
22.0
Power Dissipation Pd
225mW
Diode Case Style
TSOP
No. Of Pins
6
Filter Terminals
SMD
Mounting Type
Surface Mount
Peak Reflow Compatible (260 C)
Yes
Leaded Process Compatible
Yes
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Tolerance
-
Other names
STF202-22T1GOSTR

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Company:
Bonase Electronics (HK) Co., Limited Bonase Electronics (HK) Co., Limited
Part Number:
STF202-22T1G
Manufacturer:
ON Semiconductor
Quantity:
2 350
Price:
Company:
Bonase Electronics (HK) Co., Limited Bonase Electronics (HK) Co., Limited
Part Number:
STF202-22T1G
Manufacturer:
ON
Quantity:
56 000
Price:
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
ON Semiconductor and
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
0.05
NOTE 5
E1
A1
e
É É
É É
6
1
2
5
D
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
3
4
b
E
A
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
c
DETAIL Z
L
N. American Technical Support: 800−282−9855 Toll Free
Europe, Middle East and Africa Technical Support:
Japan Customer Focus Center
PACKAGE DIMENSIONS
USA/Canada
Phone: 421 33 790 2910
Phone: 81−3−5773−3850
DETAIL Z
H
SOLDERING FOOTPRINT*
M
3.20
http://onsemi.com
CASE 318G−02
RECOMMENDED
L2
C
ISSUE U
GAUGE
TSOP−6
PLANE
SEATING
PLANE
DIMENSIONS: MILLIMETERS
6
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM
4. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH,
5. PIN ONE INDICATOR MUST BE LOCATED IN THE INDICATED ZONE.
LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL.
PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR
GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE. DIMENSIONS D
AND E1 ARE DETERMINED AT DATUM H.
0.95
PITCH
DIM
A1
0.60
E1
L2
6X
0.95
A
D
E
M
6X
b
c
e
L
0.90
0.01
0.25
0.10
2.90
2.50
1.30
0.85
0.20
MIN
MILLIMETERS
0.25 BSC
NOM
1.00
0.06
0.38
0.18
3.00
2.75
1.50
0.95
0.40
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
MAX
1.10
0.10
0.50
0.26
3.10
3.00
1.70
1.05
0.60
10°
STYLE 8:
PIN 1. Vbus
2. D(in)-
3. D(in)+
4. D(out)+
5. D(out)-
6. GND
STF202−22T1/D

Related parts for STF202-22T1G