LPC1778FET208,551 NXP Semiconductors, LPC1778FET208,551 Datasheet - Page 5

• Manufacturer Part Number: LPC1778FET208,551
• Description: MCU ARM 512K FLASH 208-TFBGA
• Manufacturer: NXP Semiconductors
• Series: LPC17xxr

Specifications of LPC1778FET208,551

• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 100MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I²C, Microwire, MMC, SPI, SSI, SSP, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
• Number Of I /o: 165
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 4K x 8
• Ram Size: 96K x 8
• Voltage - Supply (vcc/vdd): 2.4 V ~ 3.6 V
• Data Converters: A/D 8x12b, D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 208-TFBGA
• Processor Series: LPC177x
• Core: ARM Cortex M3
• Data Bus Width: 32 bit
• Data Ram Size: 96 KB
• Interface Type: SSP, I2S, USB, JTAG, Serial, UART, I2C, SD/MMC
• Maximum Clock Frequency: 100 MHz
• Number Of Programmable I/os: 165
• Number Of Timers: 4
• Operating Supply Voltage: 2.4 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Operating Temperature Range: - 40 C to + 85 C
• Supply Current (max): 100 mA
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-6688

NXP Semiconductors
4. Ordering information
Table 1.
LPC178X_7X
Objective data sheet
Type number
LPC1788
LPC1788FBD208
LPC1788FET208
LPC1788FET180
LPC1788FBD144
LPC1787
LPC1787FBD208
LPC1786
LPC1786FBD208
LPC1785
LPC1785FBD208
LPC1778
LPC1778FBD208
LPC1778FET208
LPC1778FET180
LPC1778FBD144
LPC1777
LPC1777FBD208
LPC1776
LPC1776FBD208
LPC1776FET180
LPC1774
LPC1774FBD208
LPC1774FBD144
Ordering information
Package
Name
LQFP208
TFBGA208
TFBGA180
LQFP144
LQFP208
LQFP208
LQFP208
LQFP208
TFBGA208
TFBGA180
LQFP144
LQFP208
LQFP208
TFBGA180
LQFP208
LQFP144
Description
plastic low profile quad flat package; 208 leads; body 28  28  1.4 mm
plastic thin fine-pitch ball grid array package; 208 balls; body
15  15  0.7 mm
thin fine-pitch ball grid array package; 180 balls; body 12  12 0.8 mm
plastic low profile quad flat package; 144 leads; body 20  20  1.4 mm
plastic low profile quad flat package; 208 leads; body 28  28  1.4 mm
plastic low profile quad flat package; 208 leads; body 28  28  1.4 mm
plastic low profile quad flat package; 208 leads; body 28  28  1.4 mm
plastic low profile quad flat package; 208 leads; body 28  28  1.4 mm
plastic thin fine-pitch ball grid array package; 208 balls; body
15  15  0.7 mm
thin fine-pitch ball grid array package; 180 balls; body 12  12 0.8 mm
plastic low profile quad flat package; 144 leads; body 20  20  1.4 mm
plastic low profile quad flat package; 208 leads; body 28  28  1.4 mm
plastic low profile quad flat package; 208 leads; body 28  28  1.4 mm
thin fine-pitch ball grid array package; 180 balls; body 12  12 0.8 mm
plastic low profile quad flat package; 208 leads; body 28  28  1.4 mm
plastic low profile quad flat package; 144 leads; body 20  20  1.4 mm
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 27 May 2011
32-bit ARM Cortex-M3 microcontroller
LPC178x/7x
© NXP B.V. 2011. All rights reserved.
Version
SOT459-1
SOT950-1
SOT570-2
SOT486-1
SOT459-1
SOT459-1
SOT459-1
SOT459-1
SOT950-1
SOT570-2
SOT486-1
SOT459-1
SOT459-1
SOT570-2
SOT459-1
SOT486-1
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