STM32L151RBT6 STMicroelectronics, STM32L151RBT6 Datasheet

no-image

STM32L151RBT6

Manufacturer Part Number
STM32L151RBT6
Description
MCU ARM 128KB FLASH 64LQFP
Manufacturer
STMicroelectronics
Series
STM32r
Datasheets

Specifications of STM32L151RBT6

Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
32MHz
Connectivity
I²C, IrDA, LIN, SPI, UART/USART, USB
Peripherals
Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number Of I /o
51
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Eeprom Size
-
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
1.65 V ~ 3.6 V
Data Converters
A/D 20x12b; D/A 2x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-LFQFP
Processor Series
STM32L151
Core
ARM Cortex M3
Data Bus Width
32 bit
Data Ram Size
16 KB
Interface Type
I2C, SPI, USART
Maximum Clock Frequency
32 MHz
Number Of Programmable I/os
51
Number Of Timers
6
Operating Supply Voltage
1.8 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Cpu Family
STM32
Device Core
ARM
Device Core Size
32b
Frequency (max)
32MHz
Total Internal Ram Size
16KB
# I/os (max)
51
Number Of Timers - General Purpose
8
Operating Supply Voltage (typ)
2.5/3.3V
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
1.8V
On-chip Adc
20-chx12-bit
On-chip Dac
2(2-chx12-bit)
Instruction Set Architecture
RISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
64
Package Type
LQFP
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
497-11193

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
STM32L151RBT6
Manufacturer:
ST
Quantity:
10 000
Part Number:
STM32L151RBT6
Manufacturer:
STMicroelectronics
Quantity:
10 000
Part Number:
STM32L151RBT6
Manufacturer:
ST
0
Part Number:
STM32L151RBT6
0
Company:
Part Number:
STM32L151RBT6
Quantity:
1 920
Part Number:
STM32L151RBT6-TR
Manufacturer:
ST
0
Part Number:
STM32L151RBT6A
Manufacturer:
VISHAY
Quantity:
40 000
Part Number:
STM32L151RBT6A
Manufacturer:
ST
0
Part Number:
STM32L151RBT6A
0
Company:
Part Number:
STM32L151RBT6A
Quantity:
2 880
Part Number:
STM32L151RBT6TR
Manufacturer:
STMicroelectronics
Quantity:
10 000
Features
February 2011
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to
change without notice.
RTC, LCD, USB, USART, I2C, SPI, timers, ADC, DAC, comparators
Operating conditions
– Operating power supply range: 1.65 V to
– Temperature range: –40 to 85 °C
Low power features
– 4 modes: Sleep, Low-power run (9 µA at
– Dynamic core voltage scaling down to
– Ultralow leakage per I/O: 50 nA
– Fast wakeup from Stop: 8 µs
– Three wakeup pins
Core: ARM 32-bit Cortex
– 32 MHz maximum frequency,
– Memory protection unit
Reset and supply management
– Low power, ultrasafe BOR (brownout reset)
– Ultralow power POR/PDR
– Programmable voltage detector (PVD)
Clock management
– 1 to 24 MHz crystal oscillator
– 32 kHz oscillator for RTC with calibration
– Internal 16 MHz factory-trimmed RC
– Internal 37 kHz low consumption RC
– Internal multispeed low power RC, 64 kHz
– PLL for CPU clock and USB (48 MHz)
Low power calendar RTC
– Alarm, periodic wakeup from Stop/Standby
Memories
– Up to 128 Kbyte of Flash memory with ECC
Ultralow power ARM-based 32-bit MCU with up to 128 KB Flash,
3.6 V (without BOR) or 1.8 V to 3.6 V (with
BOR option)
32 kHz), Low-power sleep (4.9 µA),
Stop with RTC (1.2 µA), Stop (570 nA),
Standby (300 nA)
233 µA/MHz3
33.3 DMIPS peak (Dhrystone 2.1)
with 5 selectable thresholds
to 4 MHz with a consumption down to 1.5
µA
-M3 CPU
Doc ID 17659 Rev 4
Table 1.
STM32L151xx
STM32L152xx
Reference
LQFP100 14 × 14 mm
LQFP64 10 × 10 mm
LQFP48 7 × 7 mm
– 4 Kbyte of data EEPROM with ECC
– Up to 16 Kbyte of RAM
Up to 83 fast I/Os (73 of which are 5 V-tolerant)
all mappable on 16 external interrupt vectors
Development support
– Serial wire debug, JTAG and trace
DMA: 7-channel DMA controller, supporting
timers, ADC, SPIs, I
LCD 8 × 40 or 4 × 44 with step-up converter
12-bit ADC up to 1 Msps/24 channels
– Temperature sensor and internal voltage
– Operates down to 1.8 V
2 × 12-bit DACs with output buffers
2 ultralow power comparators
– Window mode and wakeup capability
10 timers:
– 6 × 16-bit general-purpose timers, each
– 2 × 16-bit basic timers
– 2 × watchdog timers (independent and
Up to 8 communication interfaces
– Up to 2 × I
– Up to 3 × USARTs (ISO 7816 interface,
– Up to 2 × SPIs (16 Mbit/s)
– USB 2.0 full-speed interface
CRC calculation unit, 96-bit unique ID
reference
with up to 4 IC/OC/PWM channels
window)
LIN, IrDA capability, modem control)
Device summary
STM32L151CB, STM32L151RB, STM32L151VB,
STM32L151C8, STM32L151R8, STM32L151V8
STM32L152CB, STM32L152RB, STM32L152VB,
STM32L152C8, STM32L152R8, STM32L152V8
2
C interfaces (SMBus/PMBus)
BGA100 7 × 7 mm
BGA64 5 × 5 mm
STM32L151xx
STM32L152xx
2
Cs and USARTs
Part number
Preliminary data
UFQFPN48
7 × 7 mm
www.st.com
1/107
1

Related parts for STM32L151RBT6

STM32L151RBT6 Summary of contents

Page 1

Ultralow power ARM-based 32-bit MCU with up to 128 KB Flash, RTC, LCD, USB, USART, I2C, SPI, timers, ADC, DAC, comparators Features ■ Operating conditions – Operating power supply range: 1. 3.6 V (without BOR) or 1.8 V ...

Page 2

Contents Contents 1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...

Page 3

STM32L151xx, STM32L152xx 3.14.5 3.15 Communication interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...

Page 4

Contents 6.3.14 6.3.15 6.3.16 6.3.17 6.3.18 6.3.19 7 Package characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...

Page 5

STM32L151xx, STM32L152xx List of tables Table 1. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...

Page 6

List of tables Table 49. ADC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...

Page 7

STM32L151xx, STM32L152xx List of figures Figure 1. Ultralow power STM32L15xxx block diagram ...

Page 8

Introduction 1 Introduction This datasheet provides the ordering information and mechanical device characteristics of the STM32L151xx and STM32L152xx ultralow power ARM Cortex™-based microcontrollers product line. The ultralow power STM32L15xxx family includes devices in 3 different package types: from 48 pins ...

Page 9

STM32L151xx, STM32L152xx 2 Description The ultralow power STM32L15xxx incorporates the connectivity power of the universal serial bus (USB) with the high-performance ARM Cortex a 32 MHz frequency, a memory protection unit (MPU), high-speed embedded memories (Flash memory up to 128 ...

Page 10

Description 2.1 Device overview Table 2. Ultralow power STM32L15xxx device features and peripheral counts Peripheral Flash - Kbytes RAM - Kbytes Timers Communication interfaces GPIOs 12-bit synchronized ADC Number of channels 12-bit DAC Number of channels LCD (STM32L152xx Only) COM ...

Page 11

... STMicroelectronics microcontrollers ultralow power strategy which also includes STM8L101xx and STM8L15xx devices. The STM8L and STM32L families allow a continuum of performance, peripherals, system architecture and features. They are all based on STMicroelectronics 0.13 µm ultralow leakage process. Note: The ultralow power STM32L and general-purpose STM32Fxxxx families are pin-to-pin compatible ...

Page 12

Functional overview 3 Functional overview Figure 1 shows the block diagrams. Figure 1. Ultralow power STM32L15xxx block diagram alternate function on I/O port pin. 12/107 Doc ID 17659 Rev 4 STM32L151xx, STM32L152xx ...

Page 13

STM32L151xx, STM32L152xx 3.1 Low power modes The ultralow power STM32L15xxx supports dynamic voltage scaling to optimize its power consumption in run mode. The voltage from the internal low-drop regulator that supplies the logic can be adjusted according to the system’s ...

Page 14

Functional overview Standby mode, the RAM and register contents are lost except for registers in the Standby circuitry (wakeup logic, IWDG, RTC, LSI, LSE Crystal 32K osc, RCC CSR). The device exits the Standby mode in 60 µs when an ...

Page 15

STM32L151xx, STM32L152xx 3.3 Reset and supply management 3.3.1 Power supply schemes ● 1.65 to 3.6 V: external power supply for I/Os and the internal regulator. DD Provided externally through V ● SSA DDA and PLL ...

Page 16

Functional overview The boot loader is located in System Memory used to reprogram the Flash memory by using USART1 or USART2. For further details please refer to AN2606. 3.4 Clock management The clock controller distributes the clocks coming ...

Page 17

STM32L151xx, STM32L152xx Figure 2. Clock tree 2. For the USB function to be available, both HSE and PLL must be enabled, with the CPU running at either 24 MHz or 32 MHz. 3.5 Low power real-time clock and backup registers ...

Page 18

Functional overview automatically. The RTC provides a programmable alarm and programmable periodic interrupts with wakeup from Stop and Standby modes. ● The programmable wakeup time ranges from 120 µ hours ● Stop mode consumption with LSI and Auto-wakeup: ...

Page 19

STM32L151xx, STM32L152xx 3.7 Memories The STM32L15xxx devices have the following features: ● Kbyte of embedded RAM accessed (read/write) at CPU clock speed with 0 wait states. With the enhanced bus matrix, operating the RAM does not lead ...

Page 20

Functional overview 3.10 ADC (analog-to-digital converter) A 12-bit analog-to-digital converters is embedded into STM32L15xxx devices with external channels, performing conversions in single-shot or scan mode. In scan mode, automatic conversion is performed on a selected group of ...

Page 21

STM32L151xx, STM32L152xx 3.12 Ultralow power comparators and reference voltage The STM32L15xxx embeds two comparators sharing the same current bias and reference voltage. The reference voltage can be internal or external (coming from an I/O). ● one comparator with fixed threshold ...

Page 22

Functional overview TIM2, TIM3, TIM4 These timers are based on a 16-bit auto-reload up/downcounter and a 16-bit prescaler. They feature 4 independent channels each for input capture/output compare, PWM or one- pulse mode output. This gives input ...

Page 23

STM32L151xx, STM32L152xx 3.15 Communication interfaces 3.15.1 I²C bus Up to two I²C bus interfaces can operate in multimaster and slave modes. They can support standard and fast modes. They support dual slave addressing (7-bit only) and both 7- and 10-bit ...

Page 24

Functional overview 3.17 Development support Serial wire JTAG debug port (SWJ-DP) The ARM SWJ-DP interface is embedded, and is a combined JTAG and serial wire debug port that enables either a serial wire debug or a JTAG probe to be ...

Page 25

STM32L151xx, STM32L152xx 4 Pin descriptions Figure 3. STM32L15xxx UFBGA100 ballout 1 PE3 A B PE4 C PC13 RTC_AF1 WKUP2 D PC14 OSC32_IN E PC15 OSC32_OUT F PH0 OSC_IN G PH1 OSC_OUT H PC0 J VSSA K VREF- L VREF+ M ...

Page 26

Pin descriptions Figure 4. STM32L15xxx TFBGA64 ballout 1 PC14- A OSC32_IN PC15- B OSC32_OUT PH0- C OSC_IN PH1- D OSC_OUT E NRST V SSA F V REF DDA 26/107 PC13- PB9 PB4 - RTC_AF1 ...

Page 27

STM32L151xx, STM32L152xx Figure 5. STM32L15xxx LQFP100 pinout PE6-WKUP3 PC13-RTC_AF1-WKUP2 PC14-OSC32_IN PC15-OSC32_OUT PH0-OSC_IN PH1-OSC_OUT PA0-WKUP1 PE2 1 PE3 2 PE4 3 PE5 LCD VSS_5 10 VDD_5 NRST 14 PC0 15 PC1 ...

Page 28

Pin descriptions Figure 6. STM32L15xxx LQFP64 pinout PC13-RTC_AF1-WKUP2 PC15-OSC32_OUT Figure 7. STM32L15xxx LQFP48 pinout PC13 - 28/107 LCD 2 PC14-OSC32_IN 3 4 ...

Page 29

STM32L151xx, STM32L152xx Figure 8. STM32L15xxx UFQFPN48 pinout PC13-RTC_AF1 PC14-OSC32_IN PC15-OSC32_OUT PH0-OSC_IN PH1-OSC_OUT PA0-WKUP LCD VFQPN48 7 NRST V 8 SSA V 9 DDA 10 11 PA1 ...

Page 30

Pin descriptions Table 4. STM32L15xxx pin definitions Pins Pin name PE2 PE3 PE4 PE5 PE6 ( ...

Page 31

STM32L151xx, STM32L152xx Table 4. STM32L15xxx pin definitions (continued) Pins Pin name PA1 PA2 PA3 SS_4 ...

Page 32

Pin descriptions Table 4. STM32L15xxx pin definitions (continued) Pins Pin name L10 21 PB10 L11 22 PB11 F12 23 V SS_1 G12 24 V DD_1 ...

Page 33

STM32L151xx, STM32L152xx Table 4. STM32L15xxx pin definitions (continued) Pins Pin name C11 - PH2 F11 35 V SS_2 G11 36 V DD_2 A10 37 PA14 ...

Page 34

Pin descriptions Table 4. STM32L15xxx pin definitions (continued) Pins Pin name PE1 SS_3 DD_3 input output, S ...

Page 35

Table 5. Alternate function input/output AFIO0 AFIO1 AFIO2 AFIO3 Port name SYSTEM TIM2 TIM3/4 TIM9/10/11 BOOT0 BOOT0 NRST NRST TIM2_CH1_ PA0-WKUP1 WKUP1 ETR PA1 TIM2_CH2 PA2 TIM2_CH3 TIM9_CH1 PA3 TIM2_CH4 TIM9_CH2 PA4 TIM2_CH1_ PA5 ETR PA6 TIM3_CH1 TIM10_CH1 PA7 TIM3_CH2 ...

Page 36

Table 5. Alternate function input/output (continued) AFIO0 AFIO1 AFIO2 AFIO3 Port name SYSTEM TIM2 TIM3/4 TIM9/10/11 TIM2_CH1_ PA15 JTDI ETR PB0 TIM3_CH3 PB1 TIM3_CH4 PB2 BOOT1 PB3 JTDO TIM2_CH2 PB4 JTRST TIM3_CH1 PB5 TIM3_CH2 PB6 TIM4_CH1 PB7 TIM4_CH2 TIM10_CH1 PB8 ...

Page 37

Table 5. Alternate function input/output (continued) AFIO0 AFIO1 AFIO2 AFIO3 Port name SYSTEM TIM2 TIM3/4 TIM9/10/11 PC1 PC2 PC3 PC4 PC5 PC6 TIM3_CH1 PC7 TIM3_CH2 PC8 TIM3_CH3 PC9 TIM3_CH4 PC10 PC11 PC12 PC13- RTC_AF1 / RTC_AF1 WKUP2 PC14- OSC32_IN OSC32_IN ...

Page 38

Table 5. Alternate function input/output (continued) AFIO0 AFIO1 AFIO2 AFIO3 Port name SYSTEM TIM2 TIM3/4 TIM9/10/11 PD2 TIM3_ETR PD3 PD4 PD5 PD6 PD7 TIM9_CH2 PD8 PD9 PD10 PD11 PD12 TIM4_CH1 PD13 TIM4_CH2 PD14 TIM4_CH3 PD15 TIM4_CH4 PE0 TIM4_ETR TIM10_CH1 PE1 ...

Page 39

Table 5. Alternate function input/output (continued) AFIO0 AFIO1 AFIO2 AFIO3 Port name SYSTEM TIM2 TIM3/4 TIM9/10/11 PE4 TRACED1 TIM3_CH2 PE5 TRACED2 TIM9_CH1* TRACED3 / PE6 TIM9_CH2* WKUP3 PE7 PE8 TIM2_CH1_ PE9 ETR PE10 TIM2_CH2 PE11 TIM2_CH3 PE12 TIM2_CH4 PE13 PE14 ...

Page 40

Memory mapping 5 Memory mapping The memory map is shown in the following figure. Figure 9. Memory map 0xFFFF FFFF 7 0xE010 0000 Cortex- M3 Internal Peripherals 0xE000 0000 6 0xC000 0000 5 0xA000 0000 4 0x8000 0000 3 0x6000 ...

Page 41

STM32L151xx, STM32L152xx 6 Electrical characteristics 6.1 Parameter conditions Unless otherwise specified, all voltages are referenced to V 6.1.1 Minimum and maximum values Unless otherwise specified the minimum and maximum values are guaranteed in the worst conditions of ambient temperature, supply ...

Page 42

Electrical characteristics 6.1.6 Power supply scheme Figure 12. Power supply scheme 11 × 100 × 4.7 µ µ µF Caution: In this figure, the 4.7 µF capacitor must be ...

Page 43

STM32L151xx, STM32L152xx 6.2 Absolute maximum ratings Stresses above the absolute maximum ratings listed in Table 7: Current characteristics, and damage to the device. These are stress ratings only and functional operation of the device at these conditions is not implied. ...

Page 44

Electrical characteristics Table 8. Thermal characteristics Symbol T STG T J 6.3 Operating conditions 6.3.1 General operating conditions Table 9. General operating conditions Symbol f Internal AHB clock frequency HCLK f Internal APB1 clock frequency PCLK1 f Internal APB2 clock ...

Page 45

STM32L151xx, STM32L152xx Table 10. Functionalities depending on the operating power supply range Operating power DAC and ADC supply range operation V = 1.65 to 1.8 V Not functional DD Conversion V = 1.8 to 2.0 V time up to 500 ...

Page 46

Electrical characteristics 6.3.2 Embedded reset and power control block characteristics The parameters given in the following table are derived from the tests performed under the ambient temperature condition summarized in Table 11. Embedded reset and power control block characteristics Symbol ...

Page 47

STM32L151xx, STM32L152xx Table 11. Embedded reset and power control block characteristics (continued) Symbol Parameter Power on/power down reset V POR/PDR threshold V Brown-out reset threshold 0 BOR0 V Brown-out reset threshold 1 BOR1 V Brown-out reset threshold 2 BOR2 V ...

Page 48

Electrical characteristics 6.3.3 Embedded internal reference voltage The parameters given in specified. Table 12. Embedded internal reference voltage Symbol Parameter V Internal reference voltage REFINT out Internal reference current I REFINT consumption T Internal reference startup time VREFINT V and ...

Page 49

STM32L151xx, STM32L152xx 6.3.4 Supply current characteristics The current consumption is a function of several parameters and factors such as the operating voltage, ambient temperature, I/O pin loading, device software configuration, operating frequencies, I/O pin switching rate, program location in memory ...

Page 50

Electrical characteristics Table 14. Current consumption in Run mode, code with data processing running from RAM Symbol Parameter HSE = 16 MHz (PLL ON for f above 16 MHz) Supply current in Run mode (Run code executed from ...

Page 51

STM32L151xx, STM32L152xx Table 15. Current consumption in Sleep mode Symbol Parameter HSE = 16 MHz (PLL ON for f >16 MHz) Supply current in Sleep mode, code executed from RAM, Flash switched HSI clock source OFF (16 MHz) MSI clock, ...

Page 52

Electrical characteristics 1. Based on characterization, not tested in production, unless otherwise specified. 2. Oscillator bypassed (HSEBYP = 1 in RCC_CR register) 3. Data guaranteed, each individual device tested in production Table 16. Current consumption in Low power run mode ...

Page 53

STM32L151xx, STM32L152xx Table 17. Current consumption in Low power sleep mode Symbol Parameter Supply current in I (LP DD Low power Sleep) sleep mode Max allowed I Max current in DD (LP Sleep) Low power Sleep mode 1. Based on ...

Page 54

Electrical characteristics Table 18. Typical and maximum current consumptions in Stop mode Symbol Parameter Supply current (Stop Stop mode with with RTC) RTC enabled Supply current in I Stop mode ( DD (Stop) RTC disabled) Supply current ...

Page 55

STM32L151xx, STM32L152xx 3. LCD enabled with external VLCD, 1/4 duty, 1/3 bias, division ratio = 64, all pixels active, no LCD connected. Table 19. Typical and maximum current consumptions in Standby mode Symbol Parameter I DD Supply current in Standby ...

Page 56

Electrical characteristics Wakeup time from low-power mode The wakeup times given in the following table are measured on a wakeup phase with the MSI RC oscillator. The clock source used to wake up the device depends on the current operating ...

Page 57

STM32L151xx, STM32L152xx On-chip peripheral current consumption The current consumption of the on-chip peripherals is given in the following table. The MCU is placed under the following conditions: ● all I/O pins are in input mode with a static value at ...

Page 58

Electrical characteristics Table 21. Peripheral current consumption Peripheral SYSCFG & RI TIM9 TIM10 APB2 TIM11 ADC SPI1 USART1 GPIOA GPIOB GPIOC GPIOD AHB GPIOE GPIOF CRC FLASH DMA1 All enabled I DD (RTC (LCD) ( (ADC) ...

Page 59

STM32L151xx, STM32L152xx 4. Data based on a differential I conversion Including supply current of internal reference voltage. 6.3.5 External clock source characteristics High-speed external user clock generated from an external source The characteristics given in external ...

Page 60

Electrical characteristics Low-speed external user clock generated from an external source The characteristics given in the following table result from tests performed using a low- speed external clock source, and under ambient temperature and supply voltage conditions summarized in Table ...

Page 61

STM32L151xx, STM32L152xx Figure 15. High-speed external clock source AC timing diagram High-speed external clock generated from a crystal/ceramic resonator The high-speed external (HSE) clock can be supplied with MHz crystal/ceramic resonator oscillator. All the information given ...

Page 62

Electrical characteristics Table 24. HSE 1-24 MHz oscillator characteristics Symbol f Oscillator frequency OSC_IN R Feedback resistor F Recommended load capacitance versus C equivalent serial resistance of the crystal (R I HSE driving current HSE HSE oscillator power I DD(HSE) ...

Page 63

STM32L151xx, STM32L152xx Figure 16. HSE oscillator circuit diagram 1. R value depends on the crystal characteristics. EXT Low-speed external clock generated from a crystal/ceramic resonator The low-speed external (LSE) clock can be supplied with a 32.768 kHz crystal/ceramic resonator oscillator. ...

Page 64

Electrical characteristics Note: For C and recommended to use high-quality ceramic capacitors in the range selected to match the requirements of the crystal or resonator (see C and C ...

Page 65

STM32L151xx, STM32L152xx 6.3.6 Internal clock source characteristics The parameters given in temperature and V High-speed internal (HSI) RC oscillator Table 26. HSI oscillator characteristics Symbol Parameter f Frequency HSI HSI user-trimmed (2) TRIM resolution Accuracy of the (3) ACC factory-calibrated ...

Page 66

Electrical characteristics Multi-speed internal (MSI) RC oscillator Table 28. MSI oscillator characteristics Symbol Frequency after factory calibration, done MSI 3.3 V and T ACC Frequency error after factory calibration MSI MSI oscillator frequency drift D 0 °C ...

Page 67

STM32L151xx, STM32L152xx Table 28. MSI oscillator characteristics Symbol t MSI oscillator startup time SU(MSI) t MSI oscillator stabilization time STAB(MSI) f MSI oscillator frequency overshoot OVER(MSI)   1. 1. This is a deviation ...

Page 68

Electrical characteristics 6.3.7 PLL characteristics The parameters given in temperature and V Table 29. PLL characteristics Symbol PLL input clock f PLL_IN PLL input clock duty cycle f PLL multiplier output clock PLL_OUT Worst case PLL lock time t PLL ...

Page 69

STM32L151xx, STM32L152xx 6.3.8 Memory characteristics The characteristics are given at T RAM memory Table 30. RAM and hardware registers Symbol Parameter VRM Data retention mode 1. Minimum supply voltage without losing data stored in RAM (in Stop mode or under ...

Page 70

Electrical characteristics 6.3.9 EMC characteristics Susceptibility tests are performed on a sample basis during device characterization. Functional EMS (electromagnetic susceptibility) While a simple application is executed on the device (toggling 2 LEDs through I/O ports). the device is stressed by ...

Page 71

STM32L151xx, STM32L152xx Prequalification trials Most of the common failures (unexpected reset and program counter corruption) can be reproduced by manually forcing a low state on the NRST pin or the oscillator pins for 1 second. To complete these trials, ESD ...

Page 72

Electrical characteristics Static latch-up Two complementary static tests are required on six parts to assess the latch-up performance: ● A supply overvoltage is applied to each power supply pin ● A current injection is applied to each input, output and ...

Page 73

STM32L151xx, STM32L152xx Table 37. I/O static characteristics (continued) Symbol Parameter (6) I Input leakage current lkg R Weak pull-up equivalent resistor PU R Weak pull-down equivalent resistor PD C I/O pin capacitance tolerant. To sustain ...

Page 74

Electrical characteristics Table 38. Output voltage characteristics Symbol Output low level voltage for an I/O pin ( when 8 pins are sunk at same time Output high level voltage for an I/O pin ( when 8 ...

Page 75

STM32L151xx, STM32L152xx Input/output AC characteristics The definition and values of input/output AC characteristics are given in Table 39, respectively. Unless otherwise specified, the parameters given in performed under ambient temperature and V Table 9. Table 39. I/O AC characteristics OSPEEDRx ...

Page 76

Electrical characteristics Figure 18. I/O AC characteristics definition External Output on 50pF Maximum frequency is achieved if (t 6.3.12 NRST pin characteristics The NRST pin input driver uses CMOS technology. Unless otherwise specified, the parameters given in performed under ambient ...

Page 77

STM32L151xx, STM32L152xx Figure 19. Recommended NRST pin protection 1. The reset network protects the device against parasitic resets. 2. The user must ensure that the level on the NRST pin can go below the V Table 40. Otherwise the reset ...

Page 78

Electrical characteristics 6.3.14 Communications interfaces interface characteristics Unless otherwise specified, the parameters given in performed under ambient temperature, f summarized in Table 2 The line I C interface meets the requirements of the standard I with the ...

Page 79

STM32L151xx, STM32L152xx 2 Figure 20 bus AC waveforms and measurement circuit 1. Measurement points are done at CMOS levels: 0.3V Table 43. SCL frequency ( External pull-up resistance For speeds around 200 ...

Page 80

Electrical characteristics SPI characteristics Unless otherwise specified, the parameters given in the following table are derived from tests performed under ambient temperature, f conditions summarized in Refer to Section 6.3.11: I/O port characteristics function characteristics (NSS, SCK, MOSI, MISO). Table ...

Page 81

STM32L151xx, STM32L152xx Figure 21. SPI timing diagram - slave mode and CPHA = 0 NSS input t SU(NSS) CPHA= 0 CPOL=0 t w(SCKH) CPHA w(SCKL) CPOL=1 t a(SO) MISO OUT su(SI) MOSI I NPUT Figure ...

Page 82

Electrical characteristics Figure 23. SPI timing diagram - master mode High NSS input CPHA= 0 CPOL=0 CPHA= 0 CPOL=1 CPHA=1 CPOL=0 CPHA=1 CPOL=1 t su(MI) MISO INP UT MOSI OUTPUT 1. Measurement points are done at CMOS levels: 0.3V USB ...

Page 83

STM32L151xx, STM32L152xx Table 46. USB DC electrical characteristics Symbol Input levels V USB operating voltage DD (4) V Differential input sensitivity DI (4) V Differential common mode range Includes V CM (4) V Single ended receiver threshold SE Output levels ...

Page 84

Electrical characteristics 6.3.15 12-bit ADC characteristics Unless otherwise specified, the parameters given in Table 48. ADC clock frequency Symbol Parameter ADC clock f ADC frequency Table 49. ADC characteristics Symbol V Power supply DDA V Positive reference voltage REF+ V ...

Page 85

STM32L151xx, STM32L152xx Table 49. ADC characteristics (continued) Symbol t Sampling time S Total conversion time t CONV (including sampling time) Internal sample and hold C ADC capacitor External trigger frequency f TRIG Regular sequencer External trigger frequency f TRIG Injected ...

Page 86

Electrical characteristics Table 50. ADC accuracy Symbol ET Total unadjusted error EO Offset error EG Gain error ED Differential linearity error EL Integral linearity error ENOB Effective number of bits Signal-to-noise and SINAD distorsion ratio SNR Signal-to-noise ratio THD Total ...

Page 87

STM32L151xx, STM32L152xx Figure 25. ADC accuracy characteristics [1LSB IDEAL 4095 4094 4093 SSA Figure 26. Typical connection diagram using the ADC 1. Refer to Table 49 2. ...

Page 88

Electrical characteristics Figure 27. Maximum dynamic current consumption on V conversion Sampling (n cycles) ADC clock I ref+ 700µA 300µA Table 51. R max for f AIN ADC Ts Ts (cycles) (µs) 2.4 V < V DDA 4 0.25 Not ...

Page 89

STM32L151xx, STM32L152xx Figure 28. Power supply and reference decoupling ( and V REF+ REF– Figure 29. Power supply and reference decoupling ( and V REF+ REF– inputs are available only on 100-pin packages. inputs are available ...

Page 90

Electrical characteristics 6.3.16 DAC electrical specifications Data guaranteed by design, not tested in production, unless otherwise specified. Table 52. DAC characteristics Symbol Parameter V Analog supply voltage DDA Reference supply V REF+ voltage V Lower reference voltage REF- Current consumption ...

Page 91

STM32L151xx, STM32L152xx Table 52. DAC characteristics (continued) Symbol Parameter (1) (7) Gain Gain error (1) TUE Total unadjusted error Settling time (full scale: for a 12-bit code transition between the t lowest and the highest SETTLING input codes till DAC_OUT ...

Page 92

Electrical characteristics Figure 30. 12-bit buffered /non-buffered DAC Buffered/Non-buffered DAC 1. The DAC integrates an output buffer that can be used to reduce the output impedance and to drive external loads directly without the use of an external operational amplifier. ...

Page 93

STM32L151xx, STM32L152xx 6.3.18 Comparator Table 54. Comparator 1 characteristics Symbol V Analog supply voltage DDA R R 400K 400K R R 10K 10K V Comparator 1 input voltage range IN t Comparator startup time START td Propagation delay Voffset Comparator ...

Page 94

Electrical characteristics 6.3.19 LCD controller (STM32L152xx only) The STM32L152xx embeds a built-in step-up converter to provide a constant LCD reference voltage independently from the V to the V pin to decouple this converter. LCD Table 56. LCD controller characteristics Symbol ...

Page 95

STM32L151xx, STM32L152xx 7 Package characteristics 7.1 Package mechanical data In order to meet environmental requirements, ST offers these devices in different grades of ® ECOPACK packages, depending on their level of environmental compliance. ECOPACK specification s, grade definitions and product ...

Page 96

Package characteristics Figure 31. UFQFPN48 mm, 0.5 mm pitch, package (1)(2)(3) outline 1. Drawing is not to scale. 2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life. 3. There ...

Page 97

STM32L151xx, STM32L152xx Figure 33. TFBGA64 - active ball array mm, 0.5 mm pitch, package outline Seating plane 1. Drawing is not to scale. Table 58. TFBGA64 - active ball array, 5 ...

Page 98

Package characteristics Figure 34. Recommended PCB design rules for pads (0.5 mm pitch BGA) Dpad Dsm 1. Non solder mask defined (NSMD) pads are recommended mils solder paste screen printing process 98/107 Pitch 0 ...

Page 99

STM32L151xx, STM32L152xx Figure 35. UFBGA100 - ultra fine pitch ball grid array mm, 0.50 mm pitch, package outline A1 ball pad corner 1.75 1. Drawing is not to scale. Table 59. UFBGA100 - ultra fine pitch ball ...

Page 100

Package characteristics Figure 36. LQFP100 mm, 100-pin low-profile quad flat package outline 100 26 Pin identification e 1. Drawing is not to scale. 2. Dimensions are in ...

Page 101

STM32L151xx, STM32L152xx Figure 38. LQFP64 mm, 64-pin low-profile quad flat package outline Drawing is not to scale. 2. Dimensions are in millimeters. Table 61. LQFP64 mm, 64-pin low-profile quad ...

Page 102

Package characteristics Figure 40. LQFP48 mm, 48-pin low-profile quad flat package outline Seating plane ccc Pin 1 1 identification 1. Drawing is not to scale. ...

Page 103

STM32L151xx, STM32L152xx 7.2 Thermal characteristics The maximum chip-junction temperature, T using the following equation: Where: max is the maximum ambient temperature in C, ●  is the package junction-to-ambient thermal resistance, in C/W, ● JA ● P max ...

Page 104

Ordering information scheme 8 Ordering information scheme Table 64. Ordering information scheme Example: Device family STM32 = ARM-based 32-bit microcontroller Product type L = Low power Device subfamily 151: Devices without LCD 152: Devices with LCD Pin count C = ...

Page 105

STM32L151xx, STM32L152xx 9 Revision history on Table 65. Document revision history Date Revision 02-Jul-2010 01-Oct-2010 16-Dec-2010 25-Feb-2011 1 Initial release. Removed 5 V tolerance (FT) from PA3, PB0 and PC3 in STM32L15xxx pin definitions on page 30 Updated Table 11: ...

Page 106

Revision history Table 65. Document revision history (continued) Date Revision 25-Feb-2011 106/107 Updated Table 19: Typical and maximum current consumptions in Standby mode (I (WU from Standby) instead Table 20: Typical and maximum timings in Low power ...

Page 107

... STM32L151xx, STM32L152xx Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. ...

Related keywords