ICS9DB202CK-01LFT IDT, Integrated Device Technology Inc, ICS9DB202CK-01LFT Datasheet - Page 11

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ICS9DB202CK-01LFT

Manufacturer Part Number
ICS9DB202CK-01LFT
Description
IC JITTER ATTENUATOR 32-VFQFPN
Manufacturer
IDT, Integrated Device Technology Inc
Series
HiPerClockS™r
Type
Jitter Attenuatorr
Datasheet

Specifications of ICS9DB202CK-01LFT

Input
HCSL, LVDS, LVHSTL, LVPECL, SSTL
Output
HCSL
Frequency - Max
140MHz
Voltage - Supply
3.135 V ~ 3.465 V
Operating Temperature
0°C ~ 70°C
Mounting Type
Surface Mount
Package / Case
32-VFQFN
Frequency-max
140MHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
9DB202CK-01LFT

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ICS9DB202CK-01LFT
Manufacturer:
IDT, Integrated Device Technology Inc
Quantity:
10 000
This section provides information on power dissipation and junction temperature for the ICS9DB202-01.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the ICS9DB202-01 is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for V
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the
device. The maximum recommended junction temperature for HiPerClockS
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance θ
flow and a multi-layer board, the appropriate value is 34.8°C/W per Table 5 below.
Therefore, Tj for an ambient temperature of 70°C with all outputs switching is:
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow,
and the type of board (single layer or multi-layer).
T
IDT
ABLE
ICS9DB202-01
PCI EXPRESS JITTER ATTENUATOR
/ ICS
5. T
Power (core)
Power (outputs)
Total Power
The equation for Tj is as follows: Tj = θ
Tj = Junction Temperature
θ
Pd_total = Total Device Power Dissipation (example calculation is in Section 1 above)
T
70°C + 0.509W * 34.8°C/W = 87.7°C. This is well below the limit of 125°C.
JA
A
PCI EXPRESS JITTER ATTENUATOR
Multi-Layer PCB, JEDEC Standard Test Boards
= Ambient Temperature
HERMAL
= Junction-to-Ambient Thermal Resistance
R
_MAX
MAX
ESISTANCE
= V
MAX
(3.465V, with all outputs switching) = 464.3mW + 44.5mW = 508.81mW
= 44.5mW/Loaded Output pair
DD_MAX
θ θ θ θ θ
* (I
JA
FOR
DD_MAX
32-P
+ I
θ θ θ θ θ
JA
DD
DDA_MAX
= 3.3V + 5% = 3.465V, which gives worst case results.
P
0 Air Flow (Linear Feet per Minute)
IN
VFQFN, F
OWER
JA
)= 3.465V * (112mA + 22mA) = 464.3mW
* Pd_total + T
ORCED
C
ONSIDERATIONS
A
11
C
ONVECTION
34.8C/W
0
TM
devices is 125°C.
ICS9DB202CK-01 REV. B FEBRUARY 18, 2009
JA
must be used. Assuming no air

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