DAC312HPZ Analog Devices Inc, DAC312HPZ Datasheet - Page 4

• Manufacturer Part Number: DAC312HPZ
• Description: IC DAC 12BIT HS MULT 20-DIP
• Manufacturer: Analog Devices Inc

Specifications of DAC312HPZ

• Data Interface: Parallel
• Settling Time: 250ns
• Number Of Bits: 12
• Number Of Converters: 1
• Voltage Supply Source: Dual ±
• Power Dissipation (max): 375mW
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Through Hole
• Package / Case: 20-DIP (0.300", 7.62mm)
• Resolution (bits): 12bit
• Input Channel Type: Parallel
• Supply Current: -13.9mA
• Digital Ic Case Style: DIP
• No. Of Pins: 20
• Operating Temperature Range: -40°C To +85°C
• Number Of Channels: 1
• Resolution: 12b
• Interface Type: Parallel
• Single Supply Voltage (typ): Not RequiredV
• Dual Supply Voltage (typ): ±15V
• Architecture: R-2R
• Power Supply Requirement: Dual
• Output Type: Current
• Integral Nonlinearity Error: ±0.05LSB
• Single Supply Voltage (min): Not RequiredV
• Single Supply Voltage (max): Not RequiredV
• Dual Supply Voltage (min): -10.8/4.5V
• Dual Supply Voltage (max): ±18V
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Through Hole
• Pin Count: 20
• Package Type: PDIP N
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

DAC312
DICE CHARACTERISTICS
WAFER TEST LIMITS
Parameter
Resolution
Monotonicity
Nonlinearity
Output Voltage
Full-Scale
Full-Scale Symmetry
Zero-Scale Current
Differential
Logic Input Levels “0”
Logic Input Levels “1”
Logic Input Swing
Reference Bias
Power Supply
Power Supply
Power
NOTE
Electrical tests are performed at wafer probe to the limits shown. Due to variations in assembly methods and normal yield loss, yield after packaging is not guaranteed
for standard product dice. Consult factory to negotiate specifications based on dice lot qualification through sample lot assembly and testing.
DIE SIZE 0.141
Compliance
Current
Nonlinearity
Current
Sensitivity
Current
Dissipation
0.096 inch, 13,536 sq. mils (3.58
Symbol
Voc
I
I
DNL
V
V
V
I
PSSI
PSSI
I+
I–
P
FSS
ZS
15
D
IL
IH
IS
@ V
FS+
FS–
S
=
15 V, I
Ideal Step Size
Conditions
Full-Scale Current
Change <1/2 LSB
V
R
Deviation from
V
V
V+ = +13.5 V to +16.5 V, V– = –15 V
V– = –13.5 V to –16.5 V, V+ = +15 V
V
I
V
I
REF
REF
REF
14
LC
LC
S
S
REF
= +15 V
= +15 V
, R
= GND
= GND
= 1.0 mA, T
= 10.000 V
15
1.0 mA
1.0 mA
= 10.000 k
2.44 mm, 8.74 sq. mm)
A
= 25 C, unless otherwise noted. Output characteristics refer to both I
–4–
10. B10
1. B1 (MSB)
2. B2
3. B3
4. B4
5. B5
6. B6
7. B7
8. B8
9. B9
DAC312N
Limit
12
12
+10
–5
4.031
3.967
0.1
0.8
2
+18
–5
–2
7
–18
375
0.05
1
0.012
1/2
0.001
0.001
DAC312G
Limit
12
12
+10
–5
4.063
3.935
0.1
0.8
2
+18
–5
–2
7
–18
375
0.05
2
0.025
1
0.001
0.001
11. B11
12. B12 (LSB)
13. V
14. V
15. V
16. COMP
17. V–
18. I
19. I
20. V+
O
O
LC
REF
REF
/A
(+)
(–)
GND
Units
Bits min
Bits min
%FS max
V max
mA min
%FS max
V min
mW max
V min
mA max
Bits (LSB) max
V max
V max
V min
%/%max
mA max
A max
A max
A max
REV. C
OUT
and I
OUT
.