1-2040537-1 TE Connectivity, 1-2040537-1 Datasheet

MINI I/O CONNECTOR, HEADER, 8POS, THD

1-2040537-1

Manufacturer Part Number
1-2040537-1
Description
MINI I/O CONNECTOR, HEADER, 8POS, THD
Manufacturer
TE Connectivity
Series
Industrial Mini I/Or
Datasheets

Specifications of 1-2040537-1

Connector Type
Mini I/O
Gender
Header
No. Of Contacts
8
Contact Termination
Right Angle Through Hole
Connector Mounting
PCB
Contact Plating
Gold
Rohs Compliant
Yes
Product Type
Connector
Jack Type
Industrial Mini
Pcb Mounting Orientation
Side Entry (Right Angle)
Pcb Mount Style
Through Hole
Termination Method To Pc Board
Solder
Number Of Contacts Loaded
8
Grounding Options
Panel Ground and PCB Ground
Panel Stops
Without
Keyed
No
Profile
Standard
Color
Natural
Shield Material
Copper Alloy
Jack Configuration
1 x 1
Panel Mount Retention
Without
Flanged
No
Shielded
Yes
Solder Tail Contact Plating
Tin over Nickel
Height (mm [in])
7.70 [0.303]
Port Configuration
Single
Number Of Positions
8
Inverted Jack Face
No
Led
Without
Shield Plating
Nickel
Number Of Pcb Ground Tabs
2
Pcb Tail Length (mm [in])
1.50 [0.059]
Preloaded
Yes
Contact Plating, Mating Area, Material
Gold (20)
Contact Base Material
Copper Alloy
Housing Material
Thermoplastic - GF
Ul Flammability Rating
UL 94V-0
Rohs/elv Compliance
RoHS compliant, ELV compliant
Lead Free Solder Processes
Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder capable to 265°C
Rohs/elv Compliance History
Always was RoHS compliant
Pcb Thickness, Recommended (mm [in])
1.60 [0.063]
Packaging Method
Tray
Packaging Quantity
90/Tray
方法、品質保証の必要条件を規定している。
格の一部を構成する。万一本規格と製品図面の間に不一致
が生じた時は、製品図面を優先して適用すること。
格を優先して適用すること。
1. 適用範囲
1.1 内容
本規格はインダストリアルミニ I/O コネクタの製品性能、試験
適用製品名と型番は附表 1 の通りである。
2. 参考規格類
以下の規格類は本規格中で規定する範囲内において、本規
万一本規格と参考規格類の間に不一致が生じた時は、本規
A.501- 5834 :試験報告書 (SMT タイプ)
B.501- 5969 :試験報告書 (DIP タイプ)
©2011 Tyco Electronics Japan G.K.,
a TE Connectivity Ltd. Company
All Rights Reserved
TE logo is a trademark.
2.1 TE 規格
2.2 民間団体規格
A. EIA364 シリーズ
Product Specification
製品規格
INDUSTRIAL MINI I/O Connector
(インダストリアルミニ I/O コネクタ)
* Trademark
Other products, logos, and company names might be trademarks of their respective owners.
タイコエレクトロニクス ジャパン合同会社、TE Connectivity Ltd. グループ
1. Scope
1.1 Contents
This specification covers the requirements for product
performance, test methods and quality assurance
provisions of INDUSTRIAL MINI I/O Connector.
Applicable product description and part numbers are as
shown in Appendix 1.
2. Applicable Documents :
The following documents form a part of this
specification to the extent specified herein. In the event
of conflict between the requirements of this
specification and the product drawing, the product
drawing shall take precedence.
In the event of conflict between the requirements of this
specification and the referenced documents, this
specification shall take precedence.
A.501- 5834 : Test Report: (SMT TYPE)
B.501- 5969 : Test Report: (DIP TYPE)
2.1 TE Specifications:
2.2 Commercial Standards and Specifications:
A. EIA364 series
108-78405
01 SEP 11 Rev F
1 of 13
LOC B

Related parts for 1-2040537-1

1-2040537-1 Summary of contents

Page 1

... TE Specifications: A.501- 5834 : Test Report: (SMT TYPE) B.501- 5969 : Test Report: (DIP TYPE) 2.2 Commercial Standards and Specifications: A. EIA364 series タイコエレクトロニクス ジャパン合同会社、TE Connectivity Ltd. グループ ...

Page 2

... Material: Copper alloy Finish: Tin plating 3.3 Ratings: A. Voltage Rating : 30V AC (rms) B. Current Rating: 0.5A C. Temperature Rating : -40℃ to 70℃ 3.4 Performance Requirements and Test Descriptions : The product shall be designed to meet the electrical, mechanical and environmental performance requirements specified in Fig.1. ...

Page 3

... ハウジングに組み込まれ嵌合したコンタクトを 開路電圧 20mV 以下、閉路電流 100mA 以 下の条件で測定する。 ...

Page 4

... EIA364-09 Operation Speed :200cycles/hour No. of Cycles: 1500cycles.(SMT HDR) No. of Cycles: 1500cycles.(DIP HDR) EIA364-09 プラグコネクタのケーブルに、ケーブル引き出 し方向に力を加える。 ...

Page 5

... いる状態で、プラグコネクタのケーブルに 20N の引張り力を加えながら、上下左右 45 度往復 90 度を 1 回として各 20 回屈曲させ る。 ...

Page 6

... Appearance of the specimen shall be inspected after the test with the assistance of a magnifier capable of giving a magnifier of 10X. The soldered surface shall be covered with a smooth solder coating with no more than small amounts of scattering imperfections such as pin-holes or un-wet or de-wet areas ...

Page 7

... EIA364-32 Mated connector -55℃/ 30 min. +85℃/ 30 min. Making this a cycle, repeat 10 cycles. EIA364- ...

Page 8

... Termination resistance(Low Level) After it is left for 1 hour under a steady temperature/humidity measured. 試験後、総合抵抗(ローレベル)の条 ...

Page 9

... Peak temperature: 260 +0/-5 ℃ Time within 5℃ of peak:20~40 sec Ramp - cool down: 6℃/ sec max Time 25℃ to peak: 8 min max After reflow, then DIP (Legs of shell) Solder temperature 260℃±5℃ Immersion duration 10±1sec. Number of reflow : 2 ...

Page 10

... Resistance to Soldering 耐熱性 Heat (a) 欄内の数字は試験を実施する順序を示す。/Numbers indicate sequence in which tests are performed. Rev F Product Specification 製品規格 ...

Page 11

... Fig.3 総合抵抗(ローレベル)測定方法 Termination Resistance Measurement Points Fig.4 ケーブル引張り耐性、ロック強度測定方法 Cable Pull-Out、 Lock Strength Measurement Method DIP タイプの図は省略 Fig of DIP Type is omitted. ...

Page 12

... P.C.Board. Load as shown figure、 1 direction par 1 sample.) Fig.6 基板固定強度測定方法 Fixed strength to PC-Board Measurement Points ...

Page 13

... I/O コネクタ 1.27mm ピッチ 8P DIP ヘッダーアセンブリ D シェイプ タイプ 2 1-2040537-1 INDUSTRIAL MINI I/O CONN. 1.27mm PITCH 8P DIP HDR ASSY D-SHAPE TYPE 2 イ ...

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