LTC2635CUD-LMI12#TRPBF Linear Technology, LTC2635CUD-LMI12#TRPBF Datasheet - Page 29

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LTC2635CUD-LMI12#TRPBF

Manufacturer Part Number
LTC2635CUD-LMI12#TRPBF
Description
IC DAC 12BIT I2C QUAD 16-QFN
Manufacturer
Linear Technology
Datasheet

Specifications of LTC2635CUD-LMI12#TRPBF

Settling Time
4.4µs
Number Of Bits
12
Data Interface
I²C
Number Of Converters
4
Voltage Supply Source
Single Supply
Operating Temperature
0°C ~ 70°C
Mounting Type
Surface Mount
Package / Case
16-QFN
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Power Dissipation (max)
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LTC2635CUD-LMI12#TRPBFLTC2635CUD-LMI12
Manufacturer:
LT
Quantity:
10 000
Company:
Part Number:
LTC2635CUD-LMI12#TRPBFLTC2635CUD-LMI12#PBF
Manufacturer:
LINEAR/凌特
Quantity:
20 000
package Description
3.50 0.05
2.10 0.05
1.45 0.05
(4 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION (WEED-2)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
ON THE TOP AND BOTTOM OF PACKAGE
PIN 1
TOP MARK
(NOTE 6)
3.00 0.10
(4 SIDES)
16-Lead Plastic QFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1691)
0.50 BSC
0.25 0.05
0.70 0.05
PACKAGE OUTLINE
0.75 0.05
UD Package
1.45 0.10
(4-SIDES)
0.200 REF
0.00 – 0.05
BOTTOM VIEW—EXPOSED PAD
R = 0.115
TYP
15 16
0.50 BSC
0.25 0.05
1
2
(UD16) QFN 0904
0.40 0.10
PIN 1 NOTCH R = 0.20 TYP
OR 0.25 45 CHAMFER
LTC2635

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