MT46H16M32LFCM-75 L Micron Technology Inc, MT46H16M32LFCM-75 L Datasheet - Page 16
MT46H16M32LFCM-75 L
Manufacturer Part Number
MT46H16M32LFCM-75 L
Description
Manufacturer
Micron Technology Inc
Type
DDR SDRAMr
Datasheet
1.MT46H16M32LFCM-75_L.pdf
(98 pages)
Specifications of MT46H16M32LFCM-75 L
Organization
16Mx32
Density
512Mb
Address Bus
15b
Access Time (max)
6.5/6ns
Maximum Clock Rate
133MHz
Operating Supply Voltage (typ)
1.8V
Package Type
VFBGA
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
1.95V
Operating Supply Voltage (min)
1.7V
Supply Current
100mA
Pin Count
90
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / Rohs Status
Compliant
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Figure 7: 90-Ball VFBGA (10mm x 13mm)
PDF: 09005aef82d5d305
512mb_ddr_mobile_sdram_t47m.pdf – Rev. I 12/09 EN
Dimensions apply
to solder balls
post-reflow. The
pre-reflow balls
are Ø0.42 on Ø0.4
SMD ball pads.
11.2
Seating
90X Ø0.45
plane
0.1 A
0.8 TYP
5.6
Note:
A
9 8
1. All dimensions are in millimeters.
3.2
7
10 ±0.1
6.4
5 ±0.05
3 2
1
0.8 TYP
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
6.5 ±0.05
0.65 ±0.05
Ball A1 ID
16
13 ±0.1
512Mb: x16, x32 Mobile LPDDR SDRAM
Micron Technology, Inc. reserves the right to change products or specifications without notice.
1.0 MAX
Solder ball material:
Substrate material: plastic laminate
Mold compound: epoxy novolac
SAC105 (98.5% Sn, 1% Ag, 0.5% Cu)
Package Dimensions
© 2004 Micron Technology, Inc. All rights reserved.
Ball A1 ID
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