PDI1284P11DL NXP Semiconductors, PDI1284P11DL Datasheet

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PDI1284P11DL

Manufacturer Part Number
PDI1284P11DL
Description
Manufacturer
NXP Semiconductors
Datasheet

Specifications of PDI1284P11DL

Operating Temperature (max)
70C
Operating Temperature (min)
0C
Package Type
SSOP
Pin Count
48
Mounting
Surface Mount
Lead Free Status / Rohs Status
Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PDI1284P11DL
Manufacturer:
PHILIPS/飞利浦
Quantity:
20 000
1. General description
2. Features
The PDI1284P11 parallel interface chip is designed to provide an asynchronous, 8-bit,
bidirectional, parallel interface for personal computers. The PDI1284P11 includes all 19
signal lines defined by the IEEE 1284 interface specification for Byte, Nibble, EPP, and
ECP modes. The PDI1284P11 is designed for hosts or peripherals operating at 3.3 V to
interface 3.3 V or 5.0 V devices.
The eight transceiver pairs (A/B 1 to 8) allow data transmission from the A-bus to the
B-bus, or from the B-bus to the A-bus, depending on the state of the direction pin DIR.
The B-bus and the Y9 to Y13 lines have either totem pole or resistor pull-up outputs,
depending on the state of the high drive enable pin HD. The A-bus has only totem pole
style outputs. All inputs are TTL compatible with at least 400 mV of input hysteresis at
V
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CC
PDI1284P11
3.3 V parallel interface transceiver/buffer
Rev. 03 — 25 August 2008
Asynchronous operation
8-bit transceivers
Six additional buffer/driver lines peripheral to cable
Five additional control lines from cable
5 V tolerant
ESD protection:
Latch-up current protection exceeds 500 mA per JEDEC Std 19
Input hysteresis
Low-noise operation
IEEE 1284 compliant level 1 and 2
Overvoltage protection on B/Y side for off-state
A side 3-state option
B side active or resistive pull-up option
Cable side supply voltage for 5 V or 3 V operation
N
N
= 3.3 V.
HBM JESD22-A114E exceeds 2000 V
MM JESD22-A115-A exceeds 200 V
Product data sheet

Related parts for PDI1284P11DL

PDI1284P11DL Summary of contents

Page 1

PDI1284P11 3.3 V parallel interface transceiver/buffer Rev. 03 — 25 August 2008 1. General description The PDI1284P11 parallel interface chip is designed to provide an asynchronous, 8-bit, bidirectional, parallel interface for personal computers. The PDI1284P11 includes all 19 signal lines ...

Page 2

... NXP Semiconductors 3. Ordering information Table 1. Ordering information Type number Package Temperature range Name PDI1284P11DL PDI1284P11DGG PDI1284P11_3 Product data sheet 3.3 V parallel interface transceiver/buffer Description SSOP48 plastic shrink small outline package; 48 leads; body width 7.5 mm TSSOP48 plastic thin shrink small outline package; ...

Page 3

... NXP Semiconductors 4. Functional diagram Fig 1. Logic symbol PDI1284P11_3 Product data sheet HD HD CNTL A10 HD A11 HD A12 HD A13 HD A1 CNTL HD A2 CNTL HD A3 CNTL HD A4 CNTL HD A5 CNTL HD A6 CNTL HD A7 CNTL HD A8 CNTL HD PLHI A14 A15 A16 A17 HLHO 001aai290 Rev. 03 — 25 August 2008 PDI1284P11 3 ...

Page 4

... NXP Semiconductors 5. Pinning information 5.1 Pinning Fig 2. Pin configuration 5.2 Pin description Table 2. Pin description Symbol Pin Description HD 1 high drive enable/disable input 11, 12, 13, data input/output 14, 16 41, 40, 38, 37, IEEE 1284 standard output/input 36, 35, 33 A13 data input Y9 to Y13 47, 46, 45, 44, 43 IEEE 1284 standard output ...

Page 5

... NXP Semiconductors Table 2. Pin description …continued Symbol Pin HLHO 24 HLHI 25 PLHO 30 V 31, 42 CC(B) OEA 34 DIR 48 [1] Pin with pull-up resistor to load cable. 6. Functional description 6.1 Function selection [1] Table 3. Function table DIR OEA [ side driving internal IC side driving external cable (bidirectional); ...

Page 6

... NXP Semiconductors 7. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter V supply voltage CC V supply voltage B CC(B) I input clamping current IK I output clamping current OK V input voltage I V output voltage O V transient voltage trt ...

Page 7

... NXP Semiconductors 9. Static characteristics Table 6. Static characteristics ground = 0 V; unless specified otherwise. amb Symbol Parameter Conditions V LOW-level input An, Bn, Cn and PLHI inputs voltage HLHI input HIGH-level input An, Bn, PLHI inputs voltage Cn inputs; V HLHI input hysteresis An, Bn inputs voltage Cn inputs LOW-level pins An, HLHO ...

Page 8

... NXP Semiconductors 10. Dynamic characteristics Table 7. Dynamic characteristics 3.6 V; ground = Symbol Parameter t LOW to HIGH PLH propagation delay t HIGH to LOW PHL propagation delay t propagation delay pd SR slew rate t disable time dis t enable time en t propagation delay PD difference [ the same as t and PLH ...

Page 9

... NXP Semiconductors 11. Waveforms Fig 3. Input An to output propagation delays never goes below 3 and V are the typical voltage output levels that occur with the output load Fig 4. Input Bn output An propagation delays Measurement data is given measured for both a LOW-to-HIGH and a HIGH-to-LOW transition. ...

Page 10

... NXP Semiconductors DIR to A DIR output LOW-to-OFF OFF-to-LOW output HIGH-to-OFF OFF-to-HIGH Test circuit is shown in Figure Measurement points are given in V and V are the typical voltage output levels that occur with the output load Fig 6. Enable and disable times Test conditions are given in Fig 7 ...

Page 11

... NXP Semiconductors a. Input pulse definition b. Test circuit C = load capacitance includes jig and probe capacitance load resistance termination resistance should be equal to the output impedance of the pulse generator. T Test conditions for propagation delays are given in Fig 8. Test circuit for An, Bn and Yn outputs; slew rate B/Y side Table 10 ...

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... NXP Semiconductors 12. Package outline SSOP48: plastic shrink small outline package; 48 leads; body width 7 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT max. 0.4 2.35 mm 2.8 0.25 0.2 2.20 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE ...

Page 13

... NXP Semiconductors TSSOP48: plastic thin shrink small outline package; 48 leads; body width 6 pin 1 index 1 DIMENSIONS (mm are the original dimensions). A UNIT max. 0.15 1.05 mm 1.2 0.25 0.05 0.85 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. ...

Page 14

... Release date PDI1284P11_3 20080825 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Quick reference table removed. • ...

Page 15

... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...

Page 16

... NXP Semiconductors 17. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3 5 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 6 Functional description . . . . . . . . . . . . . . . . . . . 5 6.1 Function selection Limiting values Recommended operating conditions Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 8 11 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 12 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 12 13 Abbreviations ...

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