EWIXP465BAET Intel, EWIXP465BAET Datasheet - Page 40

• Manufacturer Part Number: EWIXP465BAET
• Manufacturer: Intel

Specifications of EWIXP465BAET

• Core Operating Frequency: 667MHz
• Operating Supply Voltage (typ): 1.3/1.5/2.5/3.3V
• Operating Supply Voltage (max): 1.575/2.7/3.465V
• Operating Supply Voltage (min): 1.235/2.3/3.135V
• Package Type: BGA
• Pin Count: 544
• Mounting: Surface Mount
• Operating Temperature (max): 85C
• Operating Temperature (min): -40C
• Operating Temperature Classification: Industrial
• Lead Free Status / Rohs Status: Compliant

Package Information
4.0
4.1
4.1.1
May 2005
40
Package Information
This section contains information on the following topics:
Package Description
The IXP45X/IXP46X network processors are built using a 544-ball, plastic ball grid array (PBGA)
package with a drop-in heat spreader (H).
For all extended temperature products and the 667-MHz speed option of the commercial
temperature product, a 10-mm-high, thermal-adhesive-based heat sink will be required. The heat
sink does not force the addition of any surface area to the board design.
Package Drawings
The package is shown in
•
•
•
•
“Package Description”
Numbers”
“Functional Signal Definitions” on page 46
“Signal-Pin Descriptions” on page 89
“Package Thermal Specifications” on page 114
Figure 5
Intel
which includes
®
IXP45X and Intel
and
Figure
“Package
6.
®
IXP46X Product Line of Network Processors Datasheet
Drawings”,
“Package
Document Number:
Markings”, and
306261-002
“Part