FWIXP425AB Intel, FWIXP425AB Datasheet - Page 21

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FWIXP425AB

Manufacturer Part Number
FWIXP425AB
Description
Manufacturer
Intel
Datasheet

Specifications of FWIXP425AB

Core Operating Frequency
266MHz
Package Type
BGA
Pin Count
492
Mounting
Surface Mount
Operating Temperature (max)
85C
Operating Temperature (min)
-40C
Operating Temperature Classification
Industrial
Lead Free Status / Rohs Status
Not Compliant

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General Hardware Design Considerations—Intel
plane processors
Table 3.
Note:
December 2007
Document Number: 252817-008US
SDRAM Memory Types
Figure
processors’ memory bus. The figures do not include any termination resistors that may
be needed. For best signal integrity results the designer may perform simulations.
The SDM_CLKOUT is the reference clock signal for all SDRAM devices and generated by
the onchip PLL. Layout guidelines can be found in
on page
Note:
Technology
128 Mbit
256 Mbit
512 Mbit
SDRAM
3,
The 4 M x 32, * 8 M x 32 and * 16 M x 32 devices have not been fully validated by Intel.
74.
Figure
4, and
Intel
Arrangement
* 16M x 32
* 16M x 32
* 4M x 32
* 4M x 32
* 8M x 32
* 8M x 32
16M x 16
16M x 16
32M x 16
32M x 16
SDRAM
8M x 16
8M x 16
®
Figure 5
IXP42X Product Line of Network Processors and IXC1100 Control Plane Processor
®
IXP42X product line and IXC1100 control
illustrate how the PC133 SDRAM interfaces to the
Number of Chips
2
4
1
2
2
4
1
2
2
4
1
2
Section 7.1.1, “PC 133 SDRAM Clock”
Number of Banks
(Systems)
1
2
1
2
1
2
1
2
1
2
1
2
Hardware Design Guidelines
Total Memory Size
128 Mbytes
128 Mbytes
256 Mbytes
128 Mbytes
32 Mbytes
64 Mbytes
16 Mbytes
32 Mbytes
64 Mbytes
32 Mbytes
64 Mbytes
64 Mbytes
21

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