MT49H16M36HU-33:A Micron Technology Inc, MT49H16M36HU-33:A Datasheet - Page 15
MT49H16M36HU-33:A
Manufacturer Part Number
MT49H16M36HU-33:A
Description
Manufacturer
Micron Technology Inc
Type
RLDRAMr
Datasheet
1.MT49H16M36HU-33A.pdf
(76 pages)
Specifications of MT49H16M36HU-33:A
Organization
16Mx36
Address Bus
23b
Operating Supply Voltage (typ)
1.8V
Package Type
FBGA
Operating Temp Range
0C to 95C
Operating Supply Voltage (max)
1.9V
Operating Supply Voltage (min)
1.7V
Supply Current
985mA
Pin Count
144
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / Rohs Status
Not Compliant
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Package Dimensions
Figure 6:
PDF: 09005aef80fe62fb/Source: 09005aef809f284b
576Mb_RLDRAM_II_CIO_D2.fm - Rev. H 6/09 EN
Solder ball material:
Eutectic (62% Sn,
36% Pb, 2% Ag) or
SAC305 (96.5% Sn,
3% Ag, 0.5% Cu).
Dimensions apply to
solder balls post-reflow
on Ø0.39 SMD
ball pads.
144X Ø0.51
Seating
plane
17 CTR
0.12 A
144-Ball µBGA
1 TYP
Notes:
A
12 11 10 9
1. All dimensions are in millimeters.
10.6 CTR
0.8 TYP
8.8 CTR
11 ±0.1
576Mb: x9, x18, x36 2.5V Vext, 1.8V Vdd, HSTL, CIO, RLDRAM II
10º TYP
4 3 2 1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
0.73 ±0.1
18.5 ±0.1
Ball A1 ID
15
Micron Technology, Inc., reserves the right to change products or specifications without notice.
18.1 CTR
0.34 MIN
0.49 ±0.05
1.2 MAX
Package Dimensions
©2004 Micron Technology, Inc. All rights reserved.
Ball A1 ID
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