MT47H128M8CF-25E IT:H Micron Technology Inc, MT47H128M8CF-25E IT:H Datasheet - Page 21
MT47H128M8CF-25E IT:H
Manufacturer Part Number
MT47H128M8CF-25E IT:H
Description
128MX8 DDR2 SDRAM PLASTIC IND TEMP PBF FBGA 1.8V
Manufacturer
Micron Technology Inc
Type
DDR2 SDRAMr
Datasheet
1.MT47H128M8CF-25E_ITH.pdf
(134 pages)
Specifications of MT47H128M8CF-25E IT:H
Organization
128Mx8
Density
1Gb
Address Bus
17b
Access Time (max)
400ps
Maximum Clock Rate
800MHz
Operating Supply Voltage (typ)
1.8V
Package Type
FBGA
Operating Temp Range
-40C to 85C
Operating Supply Voltage (max)
1.9V
Operating Supply Voltage (min)
1.7V
Supply Current
125mA
Pin Count
60
Mounting
Surface Mount
Operating Temperature Classification
Industrial
Lead Free Status / Rohs Status
Compliant
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Figure 10: 60-Ball FBGA (8mm x 10mm) – x4, x8
PDF: 09005aef821ae8bf
1GbDDR2.pdf – Rev. V 6/10 EN
10 ±0.1
60X Ø0.45
Dimensions
apply to solder
balls post-reflow
on Ø0.35 SMD
ball pads.
8 CTR
0.8 TYP
0.155
Notes:
9
1. All dimensions are in millimeters.
2. Solder ball material: SAC305 (96.5% Sn, 3% Ag, 0.5% Cu) or leaded Eutectic (62% Sn,
8
Nonconductive
36%Pb, 2% Ag).
7
overmold
1.8 CTR
6.4 CTR
8 ±0.1
0.8 TYP
3
2
1
B
C
D
E
F
G
H
K
L
A
J
21
A
Ball A1 ID
Exposed gold plated pad
1.0 MAX X 0.7 nominal.
Micron Technology, Inc. reserves the right to change products or specifications without notice.
Seating plane
0.12 A
1Gb: x4, x8, x16 DDR2 SDRAM
0.25 MIN
1.1 ±0.1
© 2004 Micron Technology, Inc. All rights reserved.
Ball A1 ID
Packaging
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