MT45W256KW16PEGA-70 WT Micron Technology Inc, MT45W256KW16PEGA-70 WT Datasheet - Page 6

MT45W256KW16PEGA-70 WT

Manufacturer Part Number
MT45W256KW16PEGA-70 WT
Description
Manufacturer
Micron Technology Inc
Datasheet

Specifications of MT45W256KW16PEGA-70 WT

Operating Temperature (max)
85C
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / Rohs Status
Compliant
Ball Descriptions
Table 1:
PDF: 09005aef8329b746 / Source: 09005aef82f264aa
8mb_4mb_asyncpage_cr1_0_p22z__2.fm - Rev. B 4/08 EN
F5, E5, D5, C6, C5, B6
G3, H5, H4, H3, H2,
D4, C4, C3, B4, B3,
D3, E4, F4, F3, G4,
G1, F1, F2, E2, D2,
C2, C1, B1, G6, F6,
Assignment
VFBGA Ball
A5, A4, A3
E3, G2, H6
A1
A2
G5
A6
D6
D1
H1
B5
B2
E1
E6
VFBGA Ball Descriptions
DQ[15:0]
Symbol
A[17:0]
V
V
WE#
DNU
OE#
UB#
CE#
LB#
ZZ#
V
V
NC
CC
SS
CC
SS
Q
Q
Output
Supply
Supply
Supply
Supply
Input/
Input
Input
Input
Input
Input
Input
Input
Type
Description
Address inputs: Inputs for the address accessed during READ or WRITE
operations. The address lines are also used to define the value to be loaded
into the CR.
Chip enable: Activates the device when LOW. When CE# is HIGH, the device is
disabled and goes into standby power mode.
Lower byte enable: DQ[7:0].
Output enable: Enables the output buffers when LOW. When OE# is HIGH,
the output buffers are disabled.
Upper byte enable: DQ[15:8].
Write enable: Enables WRITE operations when LOW.
Sleep enable: When ZZ# is LOW, the CR can be loaded, or the device can enter
one of two low-power modes (DPD or PAR).
Data inputs/outputs.
V
operation.
V
V
V
No connect: Not internally connected.
Do not use: DNUs must be left unconnected or tied to ground.
CC
CC
SS
SS
: Must be connected to ground.
Q: Must be connected to ground.
: Device power supply (1.7–1.95V). Power supply for device core
Q: I/O power supply (1.7–3.6V). Power supply for input/output buffers.
4Mb: 256K x16 Async/Page CellularRAM 1.0 Memory
6
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2008 Micron Technology, Inc. All rights reserved.
Ball Descriptions

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