MT29F1G08ABADAWP:D Micron Technology Inc, MT29F1G08ABADAWP:D Datasheet - Page 13
MT29F1G08ABADAWP:D
Manufacturer Part Number
MT29F1G08ABADAWP:D
Description
MICMT29F1G08ABADAWP:D 1GB SLC NAND 34NM
Manufacturer
Micron Technology Inc
Datasheet
1.MT29F1G08ABADAWPD.pdf
(93 pages)
Specifications of MT29F1G08ABADAWP:D
Cell Type
NAND
Density
8Gb
Interface Type
Parallel
Address Bus
27b
Operating Supply Voltage (typ)
3.3V
Operating Temp Range
0C to 70C
Package Type
TSOP-I
Sync/async
Asynchronous
Operating Temperature Classification
Commercial
Operating Supply Voltage (min)
2.7V
Operating Supply Voltage (max)
3.6V
Word Size
8b
Number Of Words
128M
Supply Current
35mA
Mounting
Surface Mount
Pin Count
48
Lead Free Status / Rohs Status
Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MT29F1G08ABADAWP:D
Manufacturer:
MICRON
Quantity:
3 400
Company:
Part Number:
MT29F1G08ABADAWP:D
Manufacturer:
MICRON
Quantity:
11 200
Company:
Part Number:
MT29F1G08ABADAWP:D
Manufacturer:
MICRON
Quantity:
6 000
Part Number:
MT29F1G08ABADAWP:D
Manufacturer:
MICRON
Quantity:
20 000
Figure 6: 63-Ball VFBGA (HC)
PDF: 09005aef83e5ffed
m68a.pdf – Rev. D 06/10 EN
Solder ball material:
SAC305 (96.5% Sn,
3% Ag, 0.5% Cu).
Dimensions apply to
solder balls post-
reflow on Ø0.4 SMD
ball pads.
63X Ø0.45
Seating
plane
0.12 A
8.8 CTR
0.8 TYP
A
Note:
10
1. All dimensions are in millimeters.
9
8
7
10.5 ±0.1
7.2 CTR
0.8 TYP
6
5
4
3
2
1
13
A
B
C
D
E
F
G
H
J
K
L
M
0.65 ±0.05
13 ±0.1
Ball A1 ID
Bottom side saw fiducials may or
may not be covered with soldermask.
Micron Technology, Inc. reserves the right to change products or specifications without notice.
1Gb x8, x16: NAND Flash Memory
0.25 MIN
1.0 MAX
Ball A1 ID
Package Dimensions
© 2010 Micron Technology, Inc. All rights reserved.