R1LP0408CSP-7LI Renesas Electronics America, R1LP0408CSP-7LI Datasheet

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R1LP0408CSP-7LI

Manufacturer Part Number
R1LP0408CSP-7LI
Description
Manufacturer
Renesas Electronics America
Datasheet

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R1LP0408C-I Series
Wide Temperature Range Version
4M SRAM (512-kword × 8-bit)
Description
The R1LP0408C-I is a 4-Mbit static RAM organized 512-kword × 8-bit. R1LP0408C-I Series has realized
higher density, higher performance and low power consumption by employing CMOS process technology
(6-transistor memory cell). The R1LP0408C-I Series offers low power standby power dissipation;
therefore, it is suitable for battery backup systems. It has packaged in 32-pin SOP, 32-pin TSOP II.
Features
• Single 5 V supply: 5 V ± 10%
• Access time: 55/70 ns (max)
• Power dissipation:
• Completely static memory.
• Equal access and cycle times
• Common data input and output.
• Directly TTL compatible.
• Battery backup operation.
• Operating temperature: −40 to +85°C
Rev.2.00, May.26.2004, page 1 of 12
 Active: 10 mW/MHz (typ)
 Standby: 4 µW (typ)
 No clock or timing strobe required
 Three state output
 All inputs and outputs
REJ03C0067-0200Z
May.26.2004
Rev. 2.00

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R1LP0408CSP-7LI Summary of contents

Page 1

R1LP0408C-I Series Wide Temperature Range Version 4M SRAM (512-kword × 8-bit) Description The R1LP0408C 4-Mbit static RAM organized 512-kword × 8-bit. R1LP0408C-I Series has realized higher density, higher performance and low power consumption by employing CMOS process technology ...

Page 2

... R1LP0408C-I Series Ordering Information Type No. Access time R1LP0408CSP-5SI 55 ns R1LP0408CSP-7LI 70 ns R1LP0408CSB-5SI 55 ns R1LP0408CSB-7LI 70 ns R1LP0408CSC-5SI 55 ns R1LP0408CSC-7LI 70 ns Rev.2.00, May.26.2004, page Package 525-mil 32-pin plastic SOP (32P2M-A) 400-mil 32-pin plastic TSOP II (32P3Y-H) 400-mil 32-pin plastic TSOP II reverse (32P3Y-J) ...

Page 3

R1LP0408C-I Series Pin Arrangement 32-pin SOP 32-pin TSOP 1 32 A18 2 31 A16 3 30 A14 4 29 A12 ...

Page 4

R1LP0408C-I Series Block Diagram LSB A11 A9 A8 A15 A18 A10 A13 A17 A16 A14 A12 MSB I/O0 I/O7 CS# Timing Pulse Generator WE# OE# Rev.2.00, May.26.2004, page • • • Memory Matrix Row • × 2,048 ...

Page 5

R1LP0408C-I Series Operation Table WE# CS# OE# Mode × × H Not selected Output disable Read Write Write , ×: V Note ...

Page 6

R1LP0408C-I Series DC Characteristics Parameter Input leakage current Output leakage current Operating current Average operating current Standby current −5SI Standby current to +85°C to +70°C to +40°C to +25°C −7LI to +85°C to +70°C to +40°C to +25°C Output low ...

Page 7

R1LP0408C-I Series AC Characteristics (Ta = −40 to +85° ± 10%, unless otherwise noted.) CC Test Conditions • Input pulse levels 0 • Input rise and fall time • ...

Page 8

R1LP0408C-I Series Write Cycle Parameter Write cycle time Chip selection to end of write Address setup time Address valid to end of write Write pulse width Write recovery time Write to output in high-Z Data to write time overlap Data ...

Page 9

R1LP0408C-I Series Timing Waveform Read Timing Waveform (WE Address CS# OE# High impedance Dout Rev.2.00, May.26.2004, page Valid address OLZ t HZ ...

Page 10

R1LP0408C-I Series Write Timing Waveform (1) (OE# Clock) Address OE# CS# WE# Dout Din Rev.2.00, May.26.2004, page Valid address OHZ High impedance t DW Valid ...

Page 11

R1LP0408C-I Series Write Timing Waveform (2) (OE# Low Fixed) Address CS# WE Dout Din Rev.2.00, May.26.2004, page Valid address WHZ High ...

Page 12

R1LP0408C-I Series Low V Data Retention Characteristics CC (Ta = −40 to +85°C) Parameter V for data retention CC −5SI Data to +85°C retention to +70°C current to +40°C to +25°C −7LI to +85°C to +70°C to +40°C to +25°C ...

Page 13

Revision History Rev. Date Contents of Modification Page Description  1.00 Aug.01.2003 Initial issue 2.00 May.26.2004 6 DC characteristics −5SI and −7LI items’ description are divided. 12 Low V −5SI and −7LI items’ description are divided. 12 Low V 2.4 ...

Page 14

Sales Strategic Planning Div. Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble ...

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