EPF6016ATC100-3 Altera, EPF6016ATC100-3 Datasheet - Page 5

• Manufacturer Part Number: EPF6016ATC100-3
• Description: IC FLEX 6000 FPGA 16K 100-TQFP
• Manufacturer: Altera
• Series: FLEX 6000r

Specifications of EPF6016ATC100-3

• Number Of Logic Elements/cells: 1320
• Number Of Labs/clbs: 132
• Number Of I /o: 81
• Number Of Gates: 16000
• Voltage - Supply: 3 V ~ 3.6 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C
• Package / Case: 100-TQFP, 100-VQFP
• Family Name: FLEX 6000
• Number Of Usable Gates: 16000
• Number Of Logic Blocks/elements: 1320
• # Registers: 1320
• # I/os (max): 81
• Frequency (max): 142.86MHz
• Process Technology: SRAM
• Operating Supply Voltage (typ): 3.3V
• Logic Cells: 1320
• Device System Gates: 16000
• Operating Supply Voltage (min): 3V
• Operating Supply Voltage (max): 3.6V
• Operating Temp Range: 0C to 85C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 100
• Package Type: TQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Total Ram Bits: -
• Lead Free Status / Rohs Status: Not Compliant
• Other names: 544-1274

Functional
Description
Altera Corporation
The FLEX 6000 OptiFLEX architecture consists of logic elements (LEs).
Each LE includes a 4-input look-up table (LUT), which can implement any
4-input function, a register, and dedicated paths for carry and cascade
chain functions. Because each LE contains a register, a design can be easily
pipelined without consuming more LEs. The specified gate count for
FLEX 6000 devices includes all LUTs and registers.
LEs are combined into groups called logic array blocks (LABs); each LAB
contains 10 LEs. The Altera software automatically places related LEs into
the same LAB, minimizing the number of required interconnects. Each
LAB can implement a medium-sized block of logic, such as a counter or
multiplexer.
Signal interconnections within FLEX 6000 devices—and to and from
device pins—are provided via the routing structure of the FastTrack
Interconnect. The routing structure is a series of fast, continuous row and
column channels that run the entire length and width of the device. Any
LE or pin can feed or be fed by any other LE or pin via the FastTrack
Interconnect. See “FastTrack Interconnect” on
for more information.
Each I/O pin is fed by an I/O element (IOE) located at the end of each row
and column of the FastTrack Interconnect. Each IOE contains a
bidirectional I/O buffer. Each IOE is placed next to an LAB, where it can
be driven by the local interconnect of that LAB. This feature allows fast
clock-to-output times of less than 8 ns when a pin is driven by any of the
10 LEs in the adjacent LAB. Also, any LE can drive any pin via the row and
column interconnect. I/O pins can drive the LE registers via the row and
column interconnect, providing setup times as low as 2 ns and hold times
of 0 ns. IOEs provide a variety of features, such as JTAG BST support,
slew-rate control, and tri-state buffers.
Figure 1
Each group of ten LEs is combined into an LAB, and the LABs are
arranged into rows and columns. The LABs are interconnected by the
FastTrack Interconnect. IOEs are located at the end of each FastTrack
Interconnect row and column.
shows a block diagram of the FLEX 6000 OptiFLEX architecture.
FLEX 6000 Programmable Logic Device Family Data Sheet
page 17
of this data sheet
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