EP2C35F672C8 Altera, EP2C35F672C8 Datasheet - Page 83
![IC CYCLONE II FPGA 33K 672-FBGA](/photos/6/72/67269/ep2c35f672c8_sml.jpg)
EP2C35F672C8
Manufacturer Part Number
EP2C35F672C8
Description
IC CYCLONE II FPGA 33K 672-FBGA
Manufacturer
Altera
Series
Cyclone® IIr
Datasheet
1.EP2C5T144C8N.pdf
(168 pages)
Specifications of EP2C35F672C8
Number Of Logic Elements/cells
33216
Number Of Labs/clbs
2076
Total Ram Bits
483840
Number Of I /o
475
Voltage - Supply
1.15 V ~ 1.25 V
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 85°C
Package / Case
672-FBGA
Family Name
Cyclone® II
Number Of Logic Blocks/elements
33216
# I/os (max)
475
Frequency (max)
402.58MHz
Process Technology
90nm
Operating Supply Voltage (typ)
1.2V
Logic Cells
33216
Ram Bits
483840
Operating Supply Voltage (min)
1.15V
Operating Supply Voltage (max)
1.25V
Operating Temp Range
0C to 85C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
672
Package Type
FBGA
For Use With
NANO-CYCLONE - KIT NANOBOARD AND CYCLONEII DC807-1002 - DAUGHTER CARD ALTERA CYCLONE IIP0301 - DE2 CALL FOR ACADEMIC PRICING544-1733 - PCI KIT W/CYCLONE II EP2C35N
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Number Of Gates
-
Lead Free Status / Rohs Status
Not Compliant
Other names
544-1089
EP2C35F672C8ES
EP2C35F672C8ES
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
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Manufacturer:
ALTERA
Quantity:
20 000
Company:
Part Number:
EP2C35F672C8N
Manufacturer:
YAGEO
Quantity:
500 000
Company:
Part Number:
EP2C35F672C8N
Manufacturer:
ALTERA
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Part Number:
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Manufacturer:
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Quantity:
20 000
Introduction
Cyclone II
Hot-Socketing
Specifications
Altera Corporation
February 2007
CII51004-3.1
Cyclone
insertion, or hot swap) and power sequencing support without the use of
any external devices. You can insert or remove a Cyclone II board in a
system during system operation without causing undesirable effects to
the board or to the running system bus.
The hot-socketing feature lessens the board design difficulty when using
Cyclone II devices on printed circuit boards (PCBs) that also contain a
mixture of 3.3-, 2.5-, 1.8-, and 1.5-V devices. With the Cyclone II
hot-socketing feature, you no longer need to ensure a proper power-up
sequence for each device on the board.
The Cyclone II hot-socketing feature provides:
■
■
■
This chapter also discusses the power-on reset (POR) circuitry in
Cyclone II devices. The POR circuitry keeps the devices in the reset state
until the V
Cyclone II devices offer hot-socketing capability with all three features
listed above without any external components or special design
requirements. The hot-socketing feature in Cyclone II devices offers the
following:
■
■
Board or device insertion and removal without external components
or board manipulation
Support for any power-up sequence
Non-intrusive I/O buffers to system buses during hot insertion
The device can be driven before power-up without any damage to
the device itself.
I/O pins remain tri-stated during power-up. The device does not
drive out before or during power-up, thereby affecting other buses
in operation.
®
II devices offer hot socketing (also known as hot plug-in, hot
CC
is within operating range.
4. Hot Socketing & Power-On
Reset
4–1